EB52E9
Series
• RoHS Compliant (Pb-free)
• Temperature Compensated Crystal Oscillator (TCXO)
• Stratum 3
• HCMOS Output
• 3.3V Supply Voltage
• Ceramic 10-Pad SMD Package
• External Voltage Control Option Available
EB52E9
H 2.0
L 7.0
W 5.0
OSCILLATOR
ELECTRICAL SPECIFICATIONS
Nominal Frequency (MHz)
Frequency Stability
Total Holdover Stability
Total Frequency Tolerance
Operating Temperature Range
Supply Voltage (V
DD
)
Input Current
Output Voltage Logic High (V
OH
)
Output Voltage Logic Low (V
OL
)
Rise/Fall Time
Duty Cycle
Load Drive Capability
External Trim (Control Voltage Option)
Control Voltage Range
Linearity
Input Impedance
Typical Phase Noise (at
12.800MHz)
6.400, 6.500, 9.720, 10.000, 12.800, 13.000
vs. Operating Temperature Range (V
DD
= 3.3V
DC
, V
C
= 1.65V
DC
)
Inclusive of Frequency Stability and 24 Hours Aging
Inclusive of Frequency Tolerance, Frequency Stability, V
DD
(±1%), Load
(±5%), Solder Reflow, and 20 Years Aging
±0.28ppm Maximum
±0.37ppm Maximum
±4.6ppm Maximum
See Part Numbering Guide
3.3V
DC
±5%
10mA Maximum
90% of V
DD
Minimum
10% of V
DD
Maximum
5nSec Maximum
50 ±5(%) Maximum
15pF HCMOS Load
±5ppm Minimum
0.0V
DC
to V
DD
5% Maximum
100kOhms Minimum
-80dBc/Hz
-115dBc/Hz
-135dBc/Hz
-145dBc/Hz
Enables Output
Enables Output
Disables Output: High Impedance
1pSec Maximum
5mSec Maximum
-40°C to 125°C
VOLTAGE
CLASS
REV
.
DATE
I
OH
= -4mA
I
OL
= +4mA
Measured at 20% to 80% of Waveform
Measured at 50% of Waveform
1.65V
DC
±1.65V
DC
; Positive Transfer Characteristic
At offset of 10Hz
At offset of 100Hz
At offset of 1kHz
At offset of >10kHz
Tri-State Input Voltage (V
IH
and V
IL
)
No Connect
+0.9V
DD
Minimum
+0.1V
DD
Maximum
F
J
= 12kHz to 20MHz
RMS Phase Jitter
Start Up Time
Storage Temperature Range
MANUFACTURER
CATEGORY
SERIES
PACKAGE
ECLIPTEK CORP.
OSCILLATOR
EB52E9
CERAMIC
3.3V
OS5Q
07/07
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.
PART NUMBERING GUIDE
EB52E9 C 1 V - 13.000M TR
OPERATING TEMPERATURE RANGE
B=-10°C to 60°C
C=-20°C to 70°C
FREQUENCY STABILITY
1 = ±0.28ppm Maximum
PACKAGING OPTIONS
Blank=Bulk
TR=Tape and Reel
FREQUENCY
EXTERNAL TRIM
N=None (No Connection on Pad 10)
V=Voltage Control
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
5.00
±0.10
2.00
MAX
0.40
±0.10
1.00 ±0.10 (x5)
0.80 ±0.10 (x4)
4
3
2
1
1.27
±0.10
(x4)
0.80
±0.10
10
2.54
±0.10
(x2)
5
6
7
8
9
0.60
±0.10
(x6)
1.00
±0.10
(x4)
2.54
1.4 (x4)
7.00
±0.10
Pin 1-3: Do Not Connect
Pin 4: Ground
Pin 5: Output
Pin 6-7: Do Not Connect
Pin 8: Tri-State
Pin 9: Supply Voltage
Pin 10: No Connect or
Voltage Control
MARKING
ORIENTATION
1.3
1.4
1.0
1.8
6.0
Solder Land (x5)
1.2 (x4)
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
Tolerances= +0.1
MARKING
ORIENTATION
TAPE
A
16.0±0.2
B
7.5±0.1
C
6.75±0.1
D
4.0±0.1
E
2.0±0.1
F
REEL
M
1.5 MIN
N
50 MIN
O
U
360 MAX
P
V
16.4+2-0
Q
40 MIN
QTY/REEL
1,000
20.2 MIN 13.0±0.2
F
8.0±0.1
G
H
J
A0*
K
0.32 ±0.05
L
K0*
R
2.5 MIN
S
10 MIN
T
22.4 MAX
B0* 1.5 +0.1-0.0
*Compliant to EIA 481A
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
Characteristic
Fine Leak Test
Gross Leak Test
Mechanical Shock
Vibration
Solderability
Temperature Cycling
Resistance to Soldering Heat
Resistance to Solvents
Specification
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-202, Method 213, Condition C
MIL-STD-883, Method 2007, Condition A
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MARKING SPECIFICATIONS
Line 1: E XX.XXX
Frequency in MHz (5 Digits Maximum + Decimal)
Line 2: XX Y ZZ
Week of Year
Last Digit of Year
Ecliptek Manufacturing Identifier
MANUFACTURER
CATEGORY
SERIES
PACKAGE
VOLTAGE
CLASS
REV
.
DATE
ECLIPTEK CORP.
OSCILLATOR
EB52E9
CERAMIC
3.3V
OS5Q
07/07
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.
FPGA/CPLD
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