The UT54ACS365 and UT54ACTS365 are non-inverting hex
buffer and line driver with three-state outputs. The output en-
ables (OE1 and OE2) control the three-state outputs. If OE1 or
OE2 is high, the outputs will be in a high impedance state. For
data, both OE1 and OE2 must be low.
The devices are characterized over full military temperature
range of -55°C to +125°C.
FUNCTION TABLE
INPUTS
OE1
L
L
X
H
OE2
L
L
H
X
A
L
H
X
X
OUTPUT
Y
L
H
Z
Z
PINOUTS
16-Pin DIP
Top View
OE1
A1
Y1
A2
Y2
A3
Y3
V
SS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
OE2
A6
Y6
A5
Y5
A4
Y4
16-Lead Flatpack
Top View
OE1
A1
Y1
A2
Y2
A3
Y3
V
SS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
OE2
A6
Y6
A5
Y5
A4
Y4
LOGIC SYMBOL
OE1
OE2
(1)
(15)
&
EN
A1
A2
A3
A4
A5
A6
(2)
(4)
(6)
(10)
(12)
(14)
(3)
(5)
(7)
(9)
(11)
(13)
Y1
Y2
Y3
Y4
Y5
Y6
Note:
1. Logic symbol in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
1
LOGIC DIAGRAM
OE2
(15)
A6
(14)
A5
(12)
A4
(10)
A3
(6)
A2
(4)
OE1
(1)
A1
(2)
(13)
Y6
Y5
(11)
Y4
(9)
Y3
(7)
Y2
(5)
Y1
(3)
2
OPERATIONAL ENVIRONMENT
1
PARAMETER
Total Dose
SEU Threshold
2
SEL Threshold
Neutron Fluence
LIMIT
1.0E6
80
120
1.0E14
UNITS
rads(Si)
MeV-cm
2
/mg
MeV-cm
2
/mg
n/cm
2
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
DD
V
I/O
T
STG
T
J
T
LS
Θ
JC
I
I
P
D
PARAMETER
Supply voltage
Voltage any pin
Storage Temperature range
Maximum junction temperature
Lead temperature (soldering 5 seconds)
Thermal resistance junction to case
DC input current
Maximum power dissipation
LIMIT
-0.3 to 7.0
-.3 to V
DD
+.3
-65 to +150
+175
+300
20
±10
1
UNITS
V
V
°C
°C
°C
°C/W
mA
W
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at
these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
V
DD
V
IN
T
C
PARAMETER
Supply voltage
Input voltage any pin
Temperature range
LIMIT
4.5 to 5.5
0 to V
DD
-55 to + 125
UNITS
V
V
°C
3
DC ELECTRICAL CHARACTERISTICS
7
(V
DD
= 5.0V
±
10%; V
SS
= 0V
6
, -55°C < T
C
< +125°C); Unless otherwise noted, Tc is per the temperature range ordered.
SYMBOL
V
IL
PARAMETER
Low-level input voltage
1
ACTS
ACS
High-level input voltage
1
ACTS
ACS
Input leakage current
ACTS/ACS
Low-level output voltage
3
ACTS
ACS
High-level output voltage
3
ACTS
ACS
Three-state output leakage current
Short-circuit output current
2 ,4
ACTS/ACS
Output current
10
(Sink)
I
OH
Output current
10
(Source)
P
total
I
DDQ
ΔI
DDQ
Power dissipation
2, 8, 9
Quiescent Supply Current
Quiescent Supply Current Delta
ACTS
V
IN
= V
DD
or V
SS
I
OL
= 12.0mA
I
OL
= 100μA
I
OH
= -12.0mA
I
OH
= -100μA
V
O
= V
DD
and V
SS
V
O
= V
DD
and V
SS
V
IN
= V
DD
or V
SS
V
OL
= 0.4V
V
IN
= V
DD
or V
SS
V
OH
= V
DD
- 0.4V
C
L
= 50pF
V
DD
= 5.5V
For input under test
V
IN
= V
DD
- 2.1V
For all other inputs
V
IN
= V
DD
or V
SS
V
DD
= 5.5V
C
IN
C
OUT
Input capacitance
5
Output capacitance
5
ƒ
= 1MHz @ 0V
ƒ
= 1MHz @ 0V
15
15
pF
pF
1.8
10
1.6
mW/
MHz
μA
mA
-12
mA
.7V
DD
V
DD
- 0.25
-30
30
.5V
DD
.7V
DD
-1
1
CONDITION
MIN
MAX
0.8
.3V
DD
UNIT
V
V
IH
V
I
IN
V
OL
μA
0.40
0.25
V
V
OH
V
μA
I
OZ
I
OS
I
OL
-300
12
300
mA
mA
4
Notes:
1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: V
IH
= V
IH
(min) + 20%, - 0%; V
IL
= V
IL
(max) + 0%, -
50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are
guaranteed to V
IH
(min) and V
IL
(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-38535, for current density
≤
5.0E5 amps/cm
2
, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765
pF/MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and V
SS
at
frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All specifications valid for radiation dose
≤
1E6 rads(Si).
8. Power does not include power contribution of any TTL output sink current.
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
This spring, do you want to stretch your muscles and do some fun DIY? This spring, do you want to experience TI's new boards first? This spring, do you want to communicate and discuss with everyone ar...
It is a new generation of data transmission and packet switching technology, and is a hot topic in current network technology research and application. The main features of ATM technology are: 3 ATM i...
It doesn't work at full speed. I single-step IAP and write XFLASH, but when I execute call [0xBE.w], I always get a warning, and then stvd7 dies. The program is as follows: do //burn xflash { if ( Byt...
The evolution of the power grid requires the addition of wireless connectivity to existing wired connections for asset monitoring and control. The main factors for increasing wireless connectivity inc...
After experiencing Easy Power Supply, I suddenly found that circuits can be learned in this way. It is quite interesting. However, I still like to make the actual circuit. Isn’t it more intuitive?...
Are there any SMD electrolytic capacitor packages in Cadence? It seems that there are few commonly used direct-insert electrolytic capacitor packages....
Reflow soldering, a common soldering method in modern electronics manufacturing, primarily melts solder paste and pads to form solder joints. With technological advancements, soldering equipment ha...[Details]
In recent years, the government has increasingly supported electric vehicles, and the number of electric vehicles has increased. Observant drivers will notice that there are many more green license...[Details]
Capable of providing precise and efficient thermal management for artificial intelligence computing power, intelligent sensing and autonomous driving systems
Shenzhen, ...[Details]
On August 22, Lantu Motors officially launched its Lanhai Intelligent Hybrid technology via an online livestream. This intelligent hybrid technology, which integrates a full-range 800V high-voltage...[Details]
In June 2014, the Ministry of Industry and Information Technology issued 4G FD-LTE licenses to China Unicom and China Telecom. Together with the 4G TD-LTE licenses issued to China Mobile, China Uni...[Details]
Overview
As handheld voice communication devices become more and more popular, they are increasingly used in noisy environments, such as airports, busy roads, crowded bars, etc. In such noisy ...[Details]
"We have successfully launched the first version of our dedicated chip for EMB brake-by-wire. Second-generation samples have also been successfully completed, and we are actively planning a third-g...[Details]
Intel®
Xeon®
6
-
core processors now support the new Amazon EC2 R8i and R8i-flex instances on Amazon Web Services (AWS).
These new instances offer superior performance and fast...[Details]
There are many motors that can use thyristor speed control, and they can be used in almost all industries. Various types of motors, such as fans, pumps, AC motors, DC motors, torque motors, single-...[Details]
There are more and more electric vehicles. Recently, I have heard some news about electric vehicles performing poorly in winter. I would like to briefly introduce whether heat pump technology is mo...[Details]
Analog Devices held a third-quarter fiscal 2025 earnings conference call. Vincent T. Roche, CEO and Chairman of the Board, and Richard C. Puccio, Executive Vice President and Chief Financial Office...[Details]
Facial recognition, a biometric technology that uses facial features to authenticate identity, has rapidly become a global market hotspot in recent years as the technology has entered practical use...[Details]
I believe everyone has heard of memory. If your computer is slow, your experts may recommend upgrading it to a larger capacity. But what exactly is computer memory used for? Why does memory capacit...[Details]
According to Reuters, citing people familiar with the matter, British semiconductor design company Arm Holdings (NASDAQ:ARM) has hired Rami Sinno, head of Amazon's (NASDAQ:AMZN) artificial intellig...[Details]
The automotive transmission is the foundation of a vehicle's motion. The vehicle's drivetrain transfers engine power to the drive wheels, enabling the vehicle to move. The vehicle's drivetrain cons...[Details]
DSP and ARM Processors
京公网安备 11010802033920号
EEWORLD
