5962-8866201XX datasheet, PDF - EEWORLD Datasheet

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5962-8866201XX: DescriptionStandard SRAM, 32KX8, 100ns, CMOS, CDIP28,; Categorystorage storage; File Size165KB，22 Pages; ManufacturerTEMIC; Websitehttp://www.temic.de/

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5962-8866201XX Overview

Standard SRAM, 32KX8, 100ns, CMOS, CDIP28,

5962-8866201XX Parametric

Parameter Name	Attribute value
Maker	TEMIC
package instruction	DIP, DIP28,.6
Reach Compliance Code	unknown
Maximum access time	100 ns
I/O type	COMMON
JESD-30 code	R-XDIP-T28
memory density	262144 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum standby current	0.02 A
Minimum standby current	4.5 V
Maximum slew rate	0.105 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Changes in accordance with NOR 5962-R076-92.

Redrawn with changes. Add devices 05 through 09. Add vendor

CAGE number 6Y440 to device types 01 through 04, N package only,

device types 05 through 09 X,Y,T, U and N. Add vendor CAGE

number 04713 to device types 02,03, and 04, X package only. Add

vendor CAGE number 65786 to device types 03 through 06 packages

X, Y, U, N, and M, and to device types 07 and 08, packages Y, U, N,

and M. Add vendor CAGE number 61772 to devices 05 and 06,

packages X, Y, M, N and U. Add vendor CAGE number 0K6N4 to

device types 03 through 08 packages Y,U,N, and M. Remove vendor

CAGE numbers 0BK02 and 0BYV4 from the drawing. Editorial

changes throughout.

Changes in accordance with NOR 5962-R098-95

Boilerplate update, part of 5 year review. ksr

DATE (YR-MO-DA)

91-11-26

93-0217

APPROVED

Ray Monnin

M. A. Frye

95-04-14

07-10-02

M. A. Frye

Robert M. Heber

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Kenneth S. Rice

CHECKED BY

Ray Monnin

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

APPROVED BY

Michael A. Frye

DRAWING APPROVAL DATE

88-09-27

REVISION LEVEL

SIZE

SHEET

DSCC FORM 2233

APR 97

MICROCIRCUIT, MEMORY, DIGITAL,

CMOS, 32K X 8 STATIC RAM (SRAM),

MONOLITHIC SILICON

CAGE CODE

67268

1 OF

5962-88662

5962-E598-07

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

or from

the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific

exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-

JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer

Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-

38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity

approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make

modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These

modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535

is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535, appendix A and herein.

3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.2 Truth table. The truth table shall be as specified on figure 2.

3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.

3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection only.

Each coated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and pass the

internal moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water vapor

testing shall not be decreased unless approved by the preparing activity for class M. The TRB will ascertain the requirements

as provided by MIL-PRF-38535 for classes Q and V. Samples may be pulled any time after seal.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-88662

SHEET

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