Programmable Logic Device, 35ns, PLA-Type, CMOS, CDIP24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DIP, DIP24,.3 |
| Reach Compliance Code | unknown |
| Architecture | PLA-TYPE |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| Number of entries | 20 |
| Output times | 11 |
| Number of product terms | 24 |
| Number of terminals | 24 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| propagation delay | 35 ns |
| Certification status | Not Qualified |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
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