EEWORLDEEWORLDEEWORLD

Part Number

Search

74AHC1G07GW

Description
Buffer, CMOS, PDSO5
Categorylogic    logic   
File Size72KB,16 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Environmental Compliance
Download Datasheet Parametric Compare View All

74AHC1G07GW Overview

Buffer, CMOS, PDSO5

74AHC1G07GW Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionTSSOP, TSSOP5/6,.08
Reach Compliance Codeunknown
JESD-30 codeR-PDSO-G5
JESD-609 codee3
Load capacitance (CL)50 pF
Logic integrated circuit typeBUFFER
MaximumI(ol)0.004 A
Humidity sensitivity level1
Number of terminals5
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristicsOPEN-DRAIN
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP5/6,.08
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply2/5.5 V
Prop。Delay @ Nom-Sup12.5 ns
Certification statusNot Qualified
Schmitt triggerNO
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL
Base Number Matches1
INTEGRATED CIRCUITS
DATA SHEET
74AHC1G07; 74AHCT1G07
Buffer with open-drain output
Product specification
Supersedes data of 2002 Jun 06
2002 Oct 02

74AHC1G07GW Related Products

74AHC1G07GW 74AHCT1G07GW
Description Buffer, CMOS, PDSO5 Buffer, CMOS, PDSO5,
Is it Rohs certified? conform to conform to
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction TSSOP, TSSOP5/6,.08 TSSOP, TSSOP5/6,.08
Reach Compliance Code unknown unknown
JESD-30 code R-PDSO-G5 R-PDSO-G5
JESD-609 code e3 e3
Load capacitance (CL) 50 pF 50 pF
Logic integrated circuit type BUFFER BUFFER
MaximumI(ol) 0.004 A 0.008 A
Humidity sensitivity level 1 1
Number of terminals 5 5
Maximum operating temperature 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C
Output characteristics OPEN-DRAIN OPEN-DRAIN
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP
Encapsulate equivalent code TSSOP5/6,.08 TSSOP5/6,.08
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply 2/5.5 V 5 V
Prop。Delay @ Nom-Sup 12.5 ns 9 ns
Certification status Not Qualified Not Qualified
Schmitt trigger NO NO
surface mount YES YES
technology CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE
Terminal surface Matte Tin (Sn) Matte Tin (Sn)
Terminal form GULL WING GULL WING
Terminal pitch 0.635 mm 0.635 mm
Terminal location DUAL DUAL
Base Number Matches 1 1

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1458  1473  2382  760  2142  30  48  16  44  13 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号