5962-8990502VEA datasheet, PDF

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5962-8990502VEA: DescriptionSwitching Controller, Voltage-mode, 2.2A, 1000kHz Switching Freq-Max, BIPolar, CDIP16, DIP-16; CategoryPower/power management The power supply circuit; File Size116KB，20 Pages; ManufacturerUnitrode Corporation

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5962-8990502VEA Overview

Switching Controller, Voltage-mode, 2.2A, 1000kHz Switching Freq-Max, BIPolar, CDIP16, DIP-16

5962-8990502VEA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Unitrode Corporation
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Other features	CONFIGURABLE CURRENT MODE OPERATION
Analog Integrated Circuits - Other Types	SWITCHING CONTROLLER
control mode	VOLTAGE-MODE
Control Technology	PULSE WIDTH MODULATION
Maximum input voltage	20 V
Minimum input voltage	8.8 V
Nominal input voltage	12 V
JESD-30 code	R-GDIP-T16
JESD-609 code	e0
Number of functions	1
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Maximum output current	2.2 A
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Filter level	MIL-PRF-38535 Class V
surface mount	NO
Switch configuration	SINGLE
Maximum switching frequency	1000 kHz
technology	BIPOLAR
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Add device types 02 and 03. Technical and editorial changes throughout.

Correct Figure 1 in regard to device types 02 and 03 for case outline 2.

Change V

to V

in Figure 2. Technical and editorial changes

throughout. – lgt

Add class V for vendor CAGE 48726. Add table IIB. – rrp

Make change to the Initial accuracy test as specified in the Oscillator section in

table I. - ro

DATE (YR-MO-DA)

95-10-06

98-03-27

APPROVED

M. A. FRYE

R. MONNIN

99-11-04

01-03-20

R. MONNIN

Make correction to case outline E terminal connections for device types 02 and

03 as specified in figure 1. Add case outline 2 terminal connections for device

type 01. – ro

02-06-04

R. MONNIN

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

JOSEPH A. KERBY

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

CHECKED BY

CHARLES E. BESORE

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

http://www.dscc.dla.mil

APPROVED BY

MICHAEL A. FRYE

MICROCIRCUIT, LINEAR, HIGH SPEED PULSE

WIDTH MODULATOR CONTROLLER,

MONOLITHIC SILICON

DRAWING APPROVAL DATE

91-01-31

AMSC N/A

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-89905

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

5962-E420-02

1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter

Descriptive designator

GDIP1-T16 or CDIP2-T16

CQCC1-N20

Terminals

Package style

Dual-in-line

Square leadless chip carrier

1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,

appendix A for device class M.

1.3 Absolute maximum ratings. 1/

Supply voltage (V

) :

Device type 01 ..........................................................................................................

Device types 02 and 03 ............................................................................................

DC output current, source or sink .................................................................................

Pulse output current, sink or source (0.5

µs)

Device type 01 ..........................................................................................................

Device types 02 and 03 ............................................................................................

Analog input voltage :

Device type 01 (pins INV, NINV, RAMP, S/S, and I

LSD

) ..........................................

Device types 02 and 03 (pins INV, NINV, and RAMP) .............................................

Device types 02 and 03 (pins S/S and I

LSD

) ............................................................

Clock output current .....................................................................................................

Error amplifier output current ........................................................................................

Soft start sink current ...................................................................................................

Oscillator charging current ...........................................................................................

Power dissipation (P

) 1/ 2/ ........................................................................................

Storage temperature range ..........................................................................................

Lead temperature (soldering, 10 seconds) .................................................................

Junction temperature (T

) ............................................................................................

30 V dc

22 V dc

0.5 A

2.0 A

2.2 A

-0.3 V dc to 6.0 V dc

-0.3 V dc to 7.0 V dc

-0.3 V dc to 6.0 V dc

-5.0 mA

5.0 mA

20 mA

-5.0 mA

1.0 W

-65°C to +150°C

+300°C

+150°C

Thermal resistance, junction-to-case (θ

) ................................................................. See MIL-STD-1835

Thermal resistance, junction-to-ambient (θ

) :

Case outline E .......................................................................................................... 80°C/W

Case outline 2 ........................................................................................................... 70°C/W

Power ground :

Device types 02 and 03 ............................................................................................

0.2 V

1.4 Recommended operating conditions.

Supply voltage (V

) ...................................................................................................... 10 V dc to 30 V dc

Ambient operating temperature range (T

) .................................................................. -55°C to +125°C

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a

part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in

the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the

solicitation.

_____

1/ For case E, derate linearly above T

= +60°C at 11 mW/°C. For case 2, derate linearly above T

= +40°C at 9 mW/°C.

Must withstand the added P

due to short circuit test; e.g., I

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-89905

SHEET

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-883 -

MIL-STD-1835 -

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Block diagrams. The block diagrams shall be as specified on figure 2.

3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the

full ambient operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical

tests for each subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space

limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the

RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.

Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-89905

SHEET

5962-8990502VEA Related Products

	5962-8990502VEA	5962-89905012A	5962-8990501EA	5962-89905032A	5962-8990503EA	5962-89905022A	5962-8990502EA
Description	Switching Controller, Voltage-mode, 2.2A, 1000kHz Switching Freq-Max, BIPolar, CDIP16, DIP-16	Switching Controller, Current-mode, 2A, 1000kHz Switching Freq-Max, BIPolar, CQCC20,	Switching Controller, Current-mode, 2A, 1000kHz Switching Freq-Max, BIPolar, CDIP16,	Switching Controller, Current-mode, 2.2A, 1000kHz Switching Freq-Max, BIPolar, CQCC20,	Switching Controller, Current-mode, 2.2A, 1000kHz Switching Freq-Max, BIPolar, CDIP16,	Switching Controller, Current-mode, 2.2A, 1000kHz Switching Freq-Max, BIPolar, CQCC20, LCC-20	Switching Controller, Current-mode, 2.2A, 1000kHz Switching Freq-Max, BIPolar, CDIP16, DIP-16
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Unitrode Corporation	Unitrode Corporation	Unitrode Corporation	Unitrode Corporation	Unitrode Corporation	Unitrode Corporation	Unitrode Corporation
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Analog Integrated Circuits - Other Types	SWITCHING CONTROLLER	SWITCHING CONTROLLER	SWITCHING CONTROLLER	SWITCHING CONTROLLER	SWITCHING CONTROLLER	SWITCHING CONTROLLER	SWITCHING CONTROLLER
control mode	VOLTAGE-MODE	CURRENT-MODE	CURRENT-MODE	CURRENT-MODE	CURRENT-MODE	CURRENT-MODE	CURRENT-MODE
Control Technology	PULSE WIDTH MODULATION	PULSE WIDTH MODULATION	PULSE WIDTH MODULATION	PULSE WIDTH MODULATION	PULSE WIDTH MODULATION	PULSE WIDTH MODULATION	PULSE WIDTH MODULATION
Maximum input voltage	20 V	30 V	30 V	20 V	20 V	20 V	20 V
Minimum input voltage	8.8 V	10 V	10 V	12 V	12 V	12 V	12 V
Nominal input voltage	12 V	15 V	15 V	12 V	12 V	12 V	12 V
JESD-30 code	R-GDIP-T16	S-CQCC-N20	R-CDIP-T16	S-CQCC-N20	R-CDIP-T16	S-CQCC-N20	R-CDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Number of functions	1	1	1	1	1	1	1
Number of terminals	16	20	16	20	16	20	16
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Maximum output current	2.2 A	2 A	2 A	2.2 A	2.2 A	2.2 A	2.2 A
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	QCCN	DIP	QCCN	DIP	QCCN	DIP
Encapsulate equivalent code	DIP16,.3	LCC20,.35SQ	DIP16,.3	LCC20,.35SQ	DIP16,.3	LCC20,.35SQ	DIP16,.3
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	YES	NO	YES	NO	YES	NO
Switch configuration	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE
Maximum switching frequency	1000 kHz	1000 kHz	1000 kHz	1000 kHz	1000 kHz	1000 kHz	1000 kHz
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped
Terminal form	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL	QUAD	DUAL	QUAD	DUAL
Base Number Matches	1	1	1	1	1	1	1
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maximum supply current (Isup)	-	33 mA	33 mA	36 mA	36 mA	36 mA	36 mA
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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