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Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
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On August 25th, SK Hynix announced that it has completed development and entered mass production of its 321-layer, 2Tb QLC NAND flash memory product. This achievement marks the world's first applic...[Details]
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On August 22nd, Lantu Motors unveiled a new technology called "Lanhai Intelligent Hybrid" during a live broadcast of CCTV News' "Top Laboratory." The name sounds like another new term, but a closer...[Details]
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According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
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On August 20th, Tiantai Robotics Co., Ltd., along with strategic partners including Shandong Future Robotics Technology Co., Ltd., Shandong Future Data Technology Co., Ltd., and Gangzai Robotics Gr...[Details]
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On August 21st, Zhiyuan Robotics revealed at its first partner conference that it expects shipments to reach thousands of units this year and tens of thousands next year. The company hopes to reach...[Details]
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In June 2014, the Ministry of Industry and Information Technology issued 4G FD-LTE licenses to China Unicom and China Telecom. Together with the 4G TD-LTE licenses issued to China Mobile, China Uni...[Details]
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Have you ever heard stories about "crazy appliances"? Think of microwaves that turn on automatically or ovens that preheat without any human input? With radios and electromagnetic interfaces ubiqui...[Details]
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Laird Thermal Systems has introduced the HiTemp ET series Peltier cooler modules, which can operate at high temperatures and provide on-site cooling for sensitive electronic devices.
Dig...[Details]
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SMT placement machines are important equipment in surface mount technology (Surface Mount Technology). Their performance has a decisive impact on the quality and efficiency of electronic manufactur...[Details]
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A multilevel inverter converts a DC signal into a multilevel staircase waveform. Instead of a straight positive-negative output waveform, the output waveform of a multilevel inverter alternates in ...[Details]
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Coal mines typically contain gas and coal dust. When gas and coal dust reach a certain concentration, they can cause explosions. Electrical equipment generates arcs during normal operation or durin...[Details]
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Reflow soldering, as an electronics assembly process, has become a vital component of the electronics manufacturing industry. Choosing reflow soldering equipment is crucial for improving production...[Details]
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Bosch has released a new SoC series to support L2+ advanced driver assistance functions. The chip integrates high resolution and long-range detection capabilities, and has built-in support for neur...[Details]
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Tools/Materials
Yitong Chuanglian MODBUS to PROFIBUS Gateway YT-PB-03
Siemens s7-300
This article describes how to configure the YT-PB-03 MODBUS to PROFIBUS gat...[Details]