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5962-8956701ZC

Description
FIFO, 2KX9, 120ns, Asynchronous, CMOS,
Categorystorage    storage   
File Size147KB,19 Pages
ManufacturerTEMIC
Websitehttp://www.temic.de/
Download Datasheet Parametric Compare View All

5962-8956701ZC Overview

FIFO, 2KX9, 120ns, Asynchronous, CMOS,

5962-8956701ZC Parametric

Parameter NameAttribute value
MakerTEMIC
Reach Compliance Codeunknown
Maximum access time120 ns
Other featuresRETRANSMIT
period time140 ns
JESD-609 codee4
length13.97 mm
memory density18432 bit
memory width9
Number of functions1
word count2048 words
character code2000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2KX9
ExportableNO
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height3.048 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
width11.43 mm
Base Number Matches1
REVISIONS
LTR
DESCRIPTION
DATE
APPROVED
A
Updated boilerplate to reflect current requirements and made
corrections to table I and waveforms. Separated source bulletin from
the body of the drawing. - glg
01-01-30
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
A
15
A
16
A
17
A
18
REV
SHEET
PREPARED BY
Kenneth Rice
CHECKED BY
Charles Reusing
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
A
14
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY All DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
APPROVED BY
Monica L. Poelking
MICROCIRCUIT, MEMORY, DIGITAL, CMOS,
2K X 9 FIFO, MONOLITHIC SILICON
DRAWING APPROVAL DATE
27 March 1990
REVISION LEVEL
SIZE
A
A
SHEET
CAGE CODE
67268
1 OF
18
5962-89567
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E180-01

5962-8956701ZC Related Products

5962-8956701ZC 5962-8956705XA 5962-8956704ZC 5962-8956703XA 5962-8956703ZC 5962-8956701XA 5962-8956704XA 5962-8956702ZC 5962-8956702XA 5962-8956705ZC
Description FIFO, 2KX9, 120ns, Asynchronous, CMOS, FIFO, 2KX9, 40ns, Asynchronous, CMOS, 0.300 INCH, THIN, CERAMIC, DIP-28 FIFO, 2KX9, 50ns, Asynchronous, CMOS, FIFO, 2KX9, 65ns, Asynchronous, CMOS, 0.300 INCH, THIN, CERAMIC, DIP-28 FIFO, 2KX9, 65ns, Asynchronous, CMOS, FIFO, 2KX9, 120ns, Asynchronous, CMOS, CDIP28, FIFO, 2KX9, 50ns, Asynchronous, CMOS, 0.300 INCH, THIN, CERAMIC, DIP-28 FIFO, 2KX9, 80ns, Asynchronous, CMOS, FIFO, 2KX9, 80ns, Asynchronous, CMOS, 0.300 INCH, THIN, CERAMIC, DIP-28 FIFO, 2KX9, 40ns, Asynchronous, CMOS,
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
Maximum access time 120 ns 40 ns 50 ns 65 ns 65 ns 120 ns 50 ns 80 ns 80 ns 40 ns
Other features RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT
period time 140 ns 50 ns 65 ns 80 ns 80 ns 140 ns 65 ns 100 ns 100 ns 50 ns
JESD-609 code e4 e0 e4 e0 e4 e0 e0 e4 e0 e4
length 13.97 mm 37.1475 mm 13.97 mm 37.1475 mm 13.97 mm 37.1475 mm 37.1475 mm 13.97 mm 37.1475 mm 13.97 mm
memory density 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit
memory width 9 9 9 9 9 9 9 9 9 9
Number of functions 1 1 1 1 1 1 1 1 1 1
word count 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000 2000 2000 2000 2000 2000 2000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9
Exportable NO NO NO NO NO NO NO NO NO NO
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
encapsulated code QCCN DIP QCCN DIP QCCN DIP DIP QCCN DIP QCCN
Package form CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.048 mm 5.08 mm 3.048 mm 5.08 mm 3.048 mm 5.08 mm 5.08 mm 3.048 mm 5.08 mm 3.048 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES NO YES NO NO YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal surface GOLD TIN LEAD GOLD TIN LEAD GOLD TIN LEAD TIN LEAD GOLD TIN LEAD GOLD
Terminal form NO LEAD THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location QUAD DUAL QUAD DUAL QUAD DUAL DUAL QUAD DUAL QUAD
width 11.43 mm 7.62 mm 11.43 mm 7.62 mm 11.43 mm 7.62 mm 7.62 mm 11.43 mm 7.62 mm 11.43 mm
Maker TEMIC - TEMIC TEMIC TEMIC TEMIC TEMIC TEMIC TEMIC TEMIC
Base Number Matches 1 1 1 1 1 1 1 1 1 -
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