REVISIONS
LTR
A
DESCRIPTION
Add footnote 5 to section 1.4. Add footnote 3 to table I. Add vendor
CAGE number 34335, 6Y440. Add device type 06. Editorial changes
throughout.
Changes in accordance with NOR 5962-R108-94
Changes in accordance with NOR 5962-R070-95
Updated boilerplate. Add device type 07. Add vendor CAGE number
0HGZ7.
Boilerplate update, part of 5 year review. ksr
DATE (YR-MO-DA)
92-11-13
APPROVED
M. A. Frye
B
C
D
E
94-01-21
95-02-14
97-02-25
07-10-22
M. A. Frye
M. A. Frye
Ray Monnin
Robert Heber
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
E
15
E
16
E
17
E
18
REV
E
19
E
20
E
21
E
1
E
22
E
2
E
3
E
4
E
5
E
6
E
7
E
8
E
9
E
10
E
11
E
12
E
13
E
14
SHEET
PREPARED BY
Rick Officer
CHECKED BY
Ray Monnin
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
89-02-10
AMSC N/A
MICROCIRCUIT, DIGITAL, CMOS,
2K X 9 FIRST-IN, FIRST-OUT (FIFO),
MONOLITHIC SILICON
SIZE
A
SHEET
CAGE CODE
REVISION LEVEL
E
67268
1 OF
22
5962-88669
5962-E600-07
DSCC FORM 2233
APR 97
.
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-88669
01
X_
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
Generic number 1/
Circuit function
2048 X 9 FIFO
2048 X 9 FIFO
2048 X 9 FIFO
2048 X 9 FIFO
2048 X 9 FIFO
2048 X 9 FIFO
2048 X 9 FIFO
Access time
80 ns
65 ns
50 ns
40 ns
30 ns
20 ns
25 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
U
Descriptive designator
GDIP1-T28 or CDIP2-T28
CDIP3-T28 or GDIP4-T28
CQCC1-N32
GDFP2-F28
Terminals
28
28
32
28
Package style
Dual-in-line package
Dual-in-line package
Rectangular leadless chip carrier
Flat package
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range ............................................................................. -0.5 V dc to +7.0 V dc
DC voltage applied to outputs in high-Z state ........................................ -0.5 V dc to +7.0 V dc
DC input voltage range .......................................................................... -0.5 V dc to +7.0 V dc 2/
DC output current .................................................................................. 20 mA
Maximum power dissipation 3/ .............................................................. 1.0 W
Lead temperature (soldering, 10 seconds)............................................. +260°C
Thermal resistance, junction-to-case (Θ
JC
): ........................................... See MIL-STD-1835
Junction temperature (T
J
) 4/ ................................................................. +150°C
Storage temperature range .................................................................... -65°C to +150°C
Temperature under bias......................................................................... -55°C to +125°C
1/
2/
3/
4/
Generic numbers are listed on the Standard Microcircuit Source Approval Bulletin at the end of this document and will also
be listed in MIL-HDBK-103.
1.5 V undershoots are allowed for 10 ns once per cycle.
Must withstand the added P
D
due to short circuit test (e.g., I
OS
).
Maximum junction temperature may be increased to +175°C during burn-in and steady-state life.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88669
SHEET
E
2
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) ................................................................... +4.5 V dc to +5.5 V dc
Ground voltage (GND) .......................................................................... 0 V dc
Input high voltage (V
IH
) .......................................................................... 2.2 V dc minimum 5/
Input low voltage (V
IL
) ........................................................................... 0.8 V dc maximum
Case operating temperature range (T
C
) ................................................. -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-
38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity
approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535
is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection
provided that each coated microcircuit inspection lot (reference appendix A of MIL-PRF-38535, 30.1.3.8) shall be subjected to
and pass the internal moisture content test, (test method 1018 of MIL-STD-883), the frequency of the internal water vapor
testing may not be decreased unless approved by the preparing activity.
5/ V
IH
is 2.2 V minimum for all input pins except
XI
, which is 3.5 V minimum.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88669
SHEET
E
3
Renesas Electronics MCUs
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