82S129A/BEA datasheet, PDF - EEWORLD Datasheet

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82S129A/BEA: DescriptionOTP ROM, 256X4, 35ns, TTL, CDIP16,; Categorystorage storage; File Size80KB，3 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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82S129A/BEA Overview

OTP ROM, 256X4, 35ns, TTL, CDIP16,

82S129A/BEA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Maximum access time	35 ns
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
memory density	1024 bit
Memory IC Type	OTP ROM
memory width	4
Number of terminals	16
word count	256 words
character code	256
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256X4
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum slew rate	0.125 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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82S129A/BEA Related Products

	82S129A/BEA	82S126A/BFA	82S129A/BFA	82S126A/BEA
Description	OTP ROM, 256X4, 35ns, TTL, CDIP16,	OTP ROM, 256X4, 35ns, TTL, CDFP16,	OTP ROM, 256X4, 35ns, TTL, CDFP16,	OTP ROM, 256X4, 35ns, TTL, CDIP16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP16,.3	DFP, FL16,.3	DFP, FL16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown
Maximum access time	35 ns	35 ns	35 ns	35 ns
JESD-30 code	R-XDIP-T16	R-XDFP-F16	R-XDFP-F16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0
memory density	1024 bit	1024 bit	1024 bit	1024 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	4	4	4	4
Number of terminals	16	16	16	16
word count	256 words	256 words	256 words	256 words
character code	256	256	256	256
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
organize	256X4	256X4	256X4	256X4
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DFP	DFP	DIP
Encapsulate equivalent code	DIP16,.3	FL16,.3	FL16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	FLATPACK	FLATPACK	IN-LINE
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum slew rate	0.125 mA	0.125 mA	0.125 mA	0.125 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO
technology	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	FLAT	FLAT	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1

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