CERAMIC CHIP INDUCTORS
1. PART NO. EXPRESSION :
C3 SERIES
C3-1N5S-10
(a)
(b) (c)
(d)
(a) Series code
(b) Inductance code : 1N5 = 1.5nH
(d) 10 : Lead Free
(c) Tolerance code : S = ±0.3nH, J = ±5%, K = ±10%, M = ±20%
2. CONFIGURATION & DIMENSIONS :
A
D
L
G
B
C
PCB Pattern
Unit:m/m
A
B
C
D
G
1.00 Ref.
H
1.00 Ref.
H
L
3.00 Ref.
2.00±0.20 1.25±0.20 0.85±0.20 1.25±0.20 0.50±0.30
3. SCHEMATIC :
4. MATERIALS :
b
a
Ag(100%)
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
(a) Body : Ferrite
(b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION :
a) Temp. rise : 30°C Max.
b) Rated current : Base on temp. rise
c) Storage temp. : -55°C to +125°C
d) Operating temp. : -40°C to +85°C
e) Resistance to solder heat : 260°C.10secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
CERAMIC CHIP INDUCTORS
6. ELECTRICAL CHARACTERISTICS :
Part Number
C3-1N5S-10
C3-1N8S-10
C3-2N2S-10
C3-2N7S-10
C3-3N3 -10
C3-3N9 -10
C3-4N7 -10
C3-5N6 -10
C3-6N8 -10
C3-8N2 -10
C3-10N -10
C3-12N -10
C3-15N -10
C3-18N -10
C3-22N -10
C3-27N -10
C3-33N -10
C3-39N -10
C3-47N -10
C3-56N -10
C3-68N -10
C3-82N -10
C3-R10 -10
C3-R12 -10
C3-R15 -10
C3-R18 -10
C3-R22 -10
C3-R27 -10
C3-R33 -10
C3-R39 -10
C3-R47 -10
Tolerance code :
: S : ±0.3nH
J : ±5%
K : ±10%
M : ±20%
EIA
Size
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
Dim. C
( mm )
±0.2
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
Inductance
( nH )
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10.0
12.0
15.0
18.0
22.0
27.0
33.0
39.0
47.0
56.0
68.0
82.0
100.0
120.0
150.0
180.0
220.0
270.0
330.0
390.0
470.0
Test
Frequency
( MHz )
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
50
50
50
50
50
50
50
50
Q
Min.
10
10
10
12
12
12
12
15
15
15
15
15
15
15
18
18
18
18
18
18
18
18
18
13
13
13
12
12
12
10
10
Q
@ 100MHz
Nom.
21
18
18
19
16
18
18
20
20
21
20
21
22
24
23
23
24
23
23
23
25
24
23
22
22
23
20
20
22
17
17
DCR
( )
Max.
0.10
0.10
0.10
0.10
0.13
0.15
0.20
0.23
0.25
0.28
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.80
0.90
0.90
0.95
1.00
1.10
1.20
1.30
1.40
1.30
1.50
C3 SERIES
Rated Current
( mA )
Max.
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
SRF
( MHz )
Min.
4000
4000
4000
4000
4000
4000
3500
3200
2800
2400
2100
1900
1600
1500
1400
1300
1200
1000
900
800
700
600
600
500
500
400
350
300
250
250
200
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
CERAMIC CHIP INDUCTORS
7. IMPEDANCE VS. FREQUENCY CURVES :
C3 SERIES
10000
Impedance
Z vs
Frequency
HCI2012
vs.
Freq.
IMPEDANCE(Ohm
)
1000
100
22n
82n
47n
10
10n
6n8
1
10
100
1000
10000
FREQUENCY(MHz)
1000
Inductance
vs Freq.
HCI2012 L
vs. Frequency
INDUTANCE(nH)
100
82n
33n
47n
22n
10n
6n8
10
1
10
100
1000
10000
FREQUENCY(MHz)
1000
HCI2012 Q vs Freq.
Q vs. Frequency
100
Q
10
6n8
10n
82n
22n
1
10
100
47n
1000
10000
FREQUENCY(MHz)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
CERAMIC CHIP INDUCTORS
8. RELIABILITY & TEST CONDITION :
C3 SERIES
ITEM
Electrical Characteristics Test
Impedance
DC Resistance
Rated Current
Temperature Rise Test
Solder Heat Resistance
PERFORMANCE
TEST CONDITION
HP4291A, HP4287A+16092A
HP4338B
1. Applied the allowed DC current.
2. Temperature measured by digital surface thermometer.
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 260±5°C
Flux for lead free : rosin
Dip Time : 10±0.5sec.
Refer to standard electrical characteristics list
30°C max. ( t)
No mechanical damage
Remaining terminal electrode : 70% min.
Preheating Dipping
260°C
150°C
Natural
cooling
60
seconds
10±0.5
seconds
Solderability
More than 90% of the terminal electrode
should be covered with solder.
Preheating Dipping
245°C
150°C
Natural
cooling
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 245±5°C
Flux for lead free : rosin
Dip Time : 4±1sec.
60
seconds
4±1.0
seconds
Terminal Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
For C Series :
Size
1
2
3
4
5
6
Force (Kfg)
0.2
0.5
0.6
1.0
1.0
1.0
1.5
2.0
> 25
Time (sec)
W
W
7
8
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
20(.787)
Bending
45(1.772)
45(1.772)
40(1.575)
Solder a chip on a test substrate, bend the substrate
by 2mm (0.079in) and return.
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
CERAMIC CHIP INDUCTORS
8. RELIABILITY & TEST CONDITION :
C3 SERIES
ITEM
Bending Strength
PERFORMANCE
The ferrite should not be damaged by forces
applied on the right condition.
R0.5(0.02)
1.0(0.039)
TEST CONDITION
Series name
2
3
4
5
6
7
8
mm (inches)
0.80 (0.033)
1.40 (0.055)
2.00 (0.079)
2.70 (0.106)
P-Kgf
0.3
1.0
2.5
2.5
Chip
A
Random Vibration Test
Appearance : Cracking, shipping & any other
defects harmful to the characteristics should
not be allowed.
Frequency : 10-55-10Hz for 1 min.
Amplitude : 1.52mm
Directions & times : X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually perpendicular
directions (Total 6 hours).
No mechanical damage
Temperature : 85±5°C
Applied Current : rated current
Duration : 500±12hrs
Measured at room temperature after placing for 2 to 3hrs.
Humidity : 90~95% RH.
Temperature : 60±2°C
Duration : 500±12hrs
Measured at room temperature after placing for 2 to 3hrs.
Drop
Loading at High
Temperature
Drop 10 times on a concrete floor from a
height of 75cm.
Appearance : No damage.
Inductance : Within ±10% of initial value.
Q : Within ±20% of initial value.
Humidity
Thermal Shock
Appearance : No damage.
Inductance : Within ±10% of initial value.
Q : Within ±20% of initial value.
Phase
1
2
Temperature (°C)
-40±2°C
+85±5°C
Times (min.)
30±3
30±3
For C Series :
Condition for 1 cycle
Step1 : -40±2°C 30±3 min.
Step2 : +85±5°C 30±3 min.
Number of cycles : 100
Measured at room temperature after placing for 2 to 3hrs.
Temperature : -55±2°C
Duration : 500±12hrs
Measured at room temperature after placing for 2 to 3hrs.
No mechanical damage
Low temperature storage test
Measured : 100 times
Drop
Drop 10 times on a concrete floor from a
height of 75cm.
Derating Curve
Derated Current(A)
Derating
6
5
4
3
2
1
0
6A
5A
4A
3A
2A
1.5A
1A
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85°C, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
85
125
Operating Tem perature(°C)
Operating Temperature(¢X )
C
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
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