5962-9086902MUX datasheet, PDF

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5962-9086902MUX: DescriptionEEPROM, 64KX8, 250ns, Parallel, CMOS, 0.760 X 0.760 INCH, 0.120 INCH HEIGHT, PGA-36; Categorystorage storage; File Size310KB，36 Pages; ManufacturerXicor Inc.

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5962-9086902MUX Overview

EEPROM, 64KX8, 250ns, Parallel, CMOS, 0.760 X 0.760 INCH, 0.120 INCH HEIGHT, PGA-36

5962-9086902MUX Parametric

Parameter Name	Attribute value
Maker	Xicor Inc.
package instruction	PGA,
Reach Compliance Code	unknown
Maximum access time	250 ns
Other features	100000 ENDURANCE CYCLES
Durability	100000 Write/Erase Cycles
JESD-30 code	S-XPGA-P36
length	19.304 mm
memory density	524288 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	36
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64KX8
Package body material	UNSPECIFIED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Programming voltage	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	4.8768 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
width	19.305 mm
Maximum write cycle time (tWC)	5 ms
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Changes in accordance with NOR 5962-R114-92. glg

Changes in accordance with NOR 5962-R160-98. glg

Boilerplate update and part of five year review. tcr

DATE (YR-MO-DA)

92-01-22

98-08-06

07-04-13

APPROVED

Michael A. Frye

Raymond Monnin

Robert M. Heber

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Kenneth Rice

DEFENSE SUPPLY CENTER COLUMBUS

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

CHECKED BY

Charles Reusing

APPROVED BY

Michael A. Frye

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

MICROCIRCUIT, MEMORY, DIGITAL, CMOS

64K x 8 ELECTRICALLY ERASABLE PROGRAMMABLE

READ ONLY MEMORY (EEPROM), MONOLITHIC

SILICON

DRAWING APPROVAL DATE

91-10-18

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-E079-07

5962-90869

DSCC FORM 2233

APR 97

1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter

Descriptive designator

Terminals

See figure 1 (1.685" x .600" x .225")

C-12 (.560" x .458" x .120")

See figure 1 (.830" x .416" x .120")

See figure 1 (.760" x .760" x .120"

Package style

dual in-line package

rectangular chip carrier package

flat package

pin grid array

1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,

appendix A for device class M.

1.3 Absolute maximum ratings. 1/ 2/

Supply voltage range (VCC) ............................................................................... -0.5 V dc to +6.0 V dc 3/

Operating case temperature range .................................................................... -55°C to +125°C

Storage temperature range ................................................................................. -65°C to +150°C

Lead temperature (soldering, 10 seconds) ......................................................... +300°C

Thermal resistance, junction-to-case (θJC):

Case X .............................................................................................................. 28°C/W 4/

Case Y ........................................................................................................... See MIL-STD-1835

Case Z ........................................................................................................... 22°C/W 4/

Case U ........................................................................................................... 20°C/W 4/

Maximum power dissipation (PD) ...................................................................... 1.0 watts

Junction temperature (TJ) ................................................................................ +175°C 5/

Endurance........................................................................................................... 10,000 cycles/byte (minimum)

Data retention ..................................................................................................... 10 years minimum

1.4 Recommended operating conditions.

Supply voltage range (VCC) ............................................................................. 4.5 V dc minimum to 5.5 V dc maximum

Supply voltage (VSS) ........................................................................................ 0.0 V dc

High level input voltage range (VIH) .................................................................. 2.0 V dc to VCC + 1.0 V dc

Low level input voltage range (VIL) ..................................................................... -0.1 V dc to 0.8 V dc

Case operating temperature range (TC) ............................................................. -55°C to +125°C

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a

part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in

the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

_______

1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade performance and affect reliability.

2/ All voltages referenced to VSS (VSS = ground), unless otherwise specified.

3/ Negative undershoots to a minimum of -1.0 V are allowed with a maximum of 20 ns pulse width.

4/ When the thermal resistance for this case is specified in MIL-STD-1835, that value shall supersede

the value indicated herein.

5/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening

conditions in accordance with method 5004 of MIL-STD-883.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-90869

SHEET

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

or from the

Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein.

Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation.

AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)

ASTM Standard F1192 -

Standard Guide for the Measurement of Single Event Phenomena (SEP) induced by

Heavy Ion Irradiation of Semiconductor Devices.

(Applications for copies of ASTM publications should be addressed to:

ASTM International, PO Box C700, 100 Barr

Harbor Drive, West Conshohocken, PA 19428-2959;

http://www.astm.org.)

ELECTRONICS INDUSTRIES ALLIANCE (EIA)

JEDEC Standard EIA/JESD 78 - IC Latch-Up Test.

(Applications for copies should be addressed to the Electronics Industries Alliance, 2500 Wilson Boulevard, Arlington, VA

22201;

http://www.jedec.org.)

(Non-Government standards and other publications are normally available from the organizations that prepare or distribute

the documents. These documents also may be available in or through libraries or other informational services.)

2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.3 Truth table. The truth table shall be as specified on figure 3.

3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be as specified in 4.4.5e.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the full

case operating temperature range.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-90869

SHEET

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical

tests for each subgroup are defined in table IA.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer

has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be

marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be

in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535

listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of

compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see

6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this

drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and

herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for

device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.

3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2

herein) involving devices acquired to this drawing is required for any change that affects this drawing.

3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the

option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made

available onshore at the option of the reviewer.

3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in

microcircuit group number 42 (see MIL-PRF-38535, appendix A).

3.11 Processing of EEPROMs: All testing requirements and quality assurance provisions herein shall be satisfied by the

manufacturer prior to delivery.

3.11.1 Conditions of the supplied devices: Devices will be supplied in cleared state (logic "1's"). No provision will be made for

supplying written devices.

3.11.2 Clearing of EEPROMs:

characteristics specified in 4.6.4.

When specified, devices shall be cleared in accordance with the procedures and

3.11.3 Writing of EEPROMs: When specified, devices shall be written in accordance with the procedures and characteristics

specified in 4.6.3.

3.11.4 Verification of state of EEPROMs: When specified, devices shall be verified as either written to the specified pattern or

cleared. As a minimum, verification shall consist of performing a read of the entire array to verify that all bits are in the proper

state. Any bit that does not verify to be in the proper state shall constitute a device failure and the device shall be removed from

the lot or sample.

3.11.5 Power supply sequence of EEPROMs: In order to reduce the probability of inadvertent writes, the following power

supply sequences shall be observed:

A logic high state shall be applied to

and/or CE at the same time or before the application of VCC.

A logic high state shall be applied to

and/or CE at the same time or before the removal of VCC.

4. VERIFICATION

4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with

MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan

shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in

accordance with MIL-PRF-38535, appendix A.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-90869

SHEET

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