Standard SRAM, 256X1, 70ns, TTL, CDFP16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DFP, FL16,.3 |
| Reach Compliance Code | unknown |
| Maximum access time | 70 ns |
| JESD-30 code | R-XDFP-F16 |
| JESD-609 code | e0 |
| Memory IC Type | STANDARD SRAM |
| memory width | 1 |
| Number of terminals | 16 |
| word count | 256 words |
| character code | 256 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 256X1 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| 82S16/BFA | N82S16D | N82S16B | N82S116FB | N82S16N-B | N82S16NA | N82S16F | N82S116NA | |
|---|---|---|---|---|---|---|---|---|
| Description | Standard SRAM, 256X1, 70ns, TTL, CDFP16 | Standard SRAM, 256X1, 50ns, TTL, PDSO16 | Standard SRAM, 256X1, 50ns, TTL, PDIP16 | Standard SRAM, 256X1, 40ns, TTL, CDIP16 | Standard SRAM, 256X1, 50ns, TTL, PDIP16 | Standard SRAM, 256X1, 50ns, TTL, PDIP16 | Standard SRAM, 256X1, 50ns, TTL, CDIP16 | Standard SRAM, 256X1, 40ns, TTL, PDIP16 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DFP, FL16,.3 | SOP, SOP16,.4 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 70 ns | 50 ns | 50 ns | 40 ns | 50 ns | 50 ns | 50 ns | 40 ns |
| JESD-30 code | R-XDFP-F16 | R-PDSO-G16 | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| word count | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
| character code | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256X1 | 256X1 | 256X1 | 256X1 | 256X1 | 256X1 | 256X1 | 256X1 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DFP | SOP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | FL16,.3 | SOP16,.4 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | NO | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |