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5962-9461205HUX

Description
Flash Module, 512KX32, 60ns, CPGA66, 1.080 X 1.080 INCH, 0.185 INCH HEIGHT, HERMETIC SEALED, CERAMIC, PGA-66
Categorystorage    storage   
File Size239KB,20 Pages
ManufacturerCobham Semiconductor Solutions
Download Datasheet Parametric View All

5962-9461205HUX Overview

Flash Module, 512KX32, 60ns, CPGA66, 1.080 X 1.080 INCH, 0.185 INCH HEIGHT, HERMETIC SEALED, CERAMIC, PGA-66

5962-9461205HUX Parametric

Parameter NameAttribute value
MakerCobham Semiconductor Solutions
Parts packaging codePGA
package instruction1.080 X 1.080 INCH, 0.185 INCH HEIGHT, HERMETIC SEALED, CERAMIC, PGA-66
Contacts66
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time60 ns
Other featuresUSER CONFIGURABLE AS 2M X 8
Spare memory width16
JESD-30 codeS-CPGA-P66
memory density16777216 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals66
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Programming voltage5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height4.699 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
typeNOR TYPE
Base Number Matches1
ACT–F512K32 High Speed
16 Megabit FLASH Multichip Module
CIRCUIT TECHNOLOGY
Features
4 Low Power 512K x 8 FLASH Die in One MCM
www.aeroflex.com
Package
TTL Compatible Inputs and CMOS Outputs
Access Times of 60, 70, 90, 120 and 150ns
+5V Programing, 5V ±10% Supply
100,000 Erase/Program Cycles
Low Standby Current
Page Program Operation and Internal Program
Control Time
Sector Architecture (Each Die)
8 Equal size sectors of 64K bytes each
Any Combination of Sectors can be erased with
one command sequence
Supports full chip erase
Embedded Erase and Program Algorithms
MIL-PRF-38534 Compliant MCMs Available
Industry Standard Pinouts
Packaging – Hermetic Ceramic
68 Lead, .88" x .88" x .160" Single-Cavity Small
Outline gull wing, Aeroflex code# "F5"
(Drops into
the 68 Lead JEDEC .99"SQ CQFJ footprint)
66 Pin, 1.08" x 1.08" x .160" PGA Type, No
Shoulder, Aeroflex code# "P3"
66 Pin, 1.08" x 1.08" x .185" PGA Type, With
Shoulder, Aeroflex code# "P7"
Internal Decoupling Capacitors for Low Noise
Operation
Commercial, Industrial and Military Temperature
Ranges
DESC SMD# 5962–94612
Released (P3,P7,F5)
Block Diagram – PGA Type Package(P3,P7) & CQFP(F5)
General Description
The ACT–F512K32 is a high
speed, 16 megabit CMOS flash
multichip
module
(MCM)
designed for full temperature
range military, space, or high
reliability applications.
The MCM can be organized
as a 512K x 32bits, 1M x 16bits
or 2M x 8bits device and is input
TTL
and
output
CMOS
compatible.
The
command
register is written by bringing
WE to a logic low level (V
IL
),
while CE is low and OE is at
logic high level (V
IH
)
. Reading is
accomplished by chip Enable
(CE) and Output Enable (OE)
being logically active, see
Figure 9. Access time grades of
60ns, 70ns, 90ns, 120ns and
150ns maximum are standard.
The
ACT–F512K32
is
packaged in a hermetically
WE
1
CE
1
WE
2
CE
2
WE
3
CE
3
WE
4
CE
4
OE
A
0
A
18
512Kx8
512Kx8
512Kx8
512Kx8
8
I/O
0-7
8
I/O
8-15
8
I/O
16-23
8
I/O
24-31
Pin Description
I/O
0-31
Data I/O
A
0–18
Address Inputs
WE
1-4
Write Enables
CE
1-4
OE
V
CC
GND
NC
Chip Enables
Output Enable
Power Supply
Ground
Not Connected
eroflex Circuit Technology - Advanced Multichip Modules © SCD1665 REV B 6/29/01
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