Standard SRAM, 256X8, TTL, CDIP22
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DIP, DIP22,.4 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T22 |
| JESD-609 code | e0 |
| memory density | 2048 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of terminals | 22 |
| word count | 256 words |
| character code | 256 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| organize | 256X8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP22,.4 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | AUTOMOTIVE |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| 8X350/BWA-40 | 8X350/BWA | N8X350A | |
|---|---|---|---|
| Description | Standard SRAM, 256X8, TTL, CDIP22 | Standard SRAM, 256X8, TTL, CDIP22, | Standard SRAM, 256X8, TTL, PQCC28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DIP, DIP22,.4 | DIP, DIP22,.4 | QCCJ, LDCC28,.5SQ |
| Reach Compliance Code | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T22 | R-XDIP-T22 | S-PQCC-J28 |
| JESD-609 code | e0 | e0 | e0 |
| memory density | 2048 bit | 2048 bit | 2048 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 |
| Number of terminals | 22 | 22 | 28 |
| word count | 256 words | 256 words | 256 words |
| character code | 256 | 256 | 256 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 70 °C |
| Minimum operating temperature | -40 °C | -55 °C | - |
| organize | 256X8 | 256X8 | 256X8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | QCCJ |
| Encapsulate equivalent code | DIP22,.4 | DIP22,.4 | LDCC28,.5SQ |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | IN-LINE | IN-LINE | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES |
| technology | TTL | TTL | TTL |
| Temperature level | AUTOMOTIVE | MILITARY | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | J BEND |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | QUAD |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - |
| Base Number Matches | 1 | 1 | - |
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