89007-143 datasheet, PDF - EEWORLD Datasheet

89007-143: DescriptionBoard Connector, 60 Contact(s), 5 Row(s), Male, Straight, 0.079 inch Pitch, Press Fit Terminal, Locking, Plug; CategoryThe connector The connector; File Size2MB，12 Pages; ManufacturerAmphenol; Websitehttp://www.amphenol.com/

Download Datasheet Parametric View All

89007-143 Overview

Board Connector, 60 Contact(s), 5 Row(s), Male, Straight, 0.079 inch Pitch, Press Fit Terminal, Locking, Plug

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Amphenol
Reach Compliance Code	compliant
ECCN code	EAR99
body width	0.701 inch
subject depth	0.669 inch
body length	0.942 inch
Body/casing type	PLUG
Connector type	BOARD CONNECTOR
Contact to complete cooperation	NOT SPECIFIED
Contact completed and terminated	Tin/Lead (Sn/Pb)
Contact point gender	MALE
Contact material	PHOSPHOR BRONZE
contact mode	RECTANGULAR
Contact style	SQ PIN-SKT
DIN compliance	NO
Dielectric withstand voltage	1400VAC V
Filter function	NO
IEC compliance	NO
maximum insertion force	.3614 N
Insulation resistance	1000000000 Ω
insulator material	GLASS FILLED LIQUID CRYSTAL POLYMER
JESD-609 code	e0
MIL compliance	NO
Manufacturer's serial number	89007
Plug contact pitch	0.079 inch
Match contact row spacing	0.079 inch
Mixed contacts	NO
Installation option 1	LOCKING
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	5
Number of rows loaded	5
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Options	GENERAL PURPOSE
PCB contact pattern	RECTANGULAR
PCB contact row spacing	2.0066 mm
polarization key	POLARIZED HOUSING
Rated current (signal)	1 A
Guideline	UL, CSA
reliability	COMMERCIAL
Terminal pitch	2 mm
Termination type	PRESS FIT
Total number of contacts	60
UL Flammability Code	94V-0
Evacuation force-minimum value	.14734 N
Base Number Matches	1

Terran Huang

Michael Song

Tian-Zhao Lin

Collins Lu

2010/07/08

2014/12/02

2014/12/03

ELX-DG-19567-1

Released

PDS: Rev :AE

STATUS:Released

Printed: Dec 03, 2014

Cooling solutions for high-power chips: Use a metal bottom shell and add MAP soft silicone thermal pads to achieve the heat dissipation effect. In the past, many people used thermal grease as a thermal conductive material: Today's electroni...; jek9528 Industrial Control Electronics

Embedded technology exchange QQ group: Group number: 37829738 I hope you can exchange ideas on ARM, MCU, LINUX, and artificial intelligence technology....; stonepal Embedded System

Ask a few questions about TOPWIN2005 burner: When I run TOPWIN2005, an error message "Access violation at address 740b0cc2, read of address 740b0cc2" appears. I click OK and it says "Access violation at address 740b0cc2, read of address 740b0cc2...; yongle_2005 Embedded System

Development board application: I have been studying 430 for a short time and have basically mastered the basic applications. I hope to apply for this board to learn more applications! Mainly for 485 communication and matrix keyboar...; logoh Microcontroller MCU

Can the STM32 series with FSMC directly drive those TFTLCDs larger than 7 inches on the market?: Can the interface with FSMC in the STM32 series directly drive those TFT LCDs larger than 7 inches on the market?...; ttkkxx stm32/stm8

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components