PTC thermistors for thermal management
in LED driver circuits
EIA case size 0603
Series/Type:
Date:
B59602, B59603
November 2009
© EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
Thermal management in LED driver circuits
EIA case size 0603
Applications
LED driver circuits
Thermal management
Temperature compensation
Features
Tight resistance tolerance
Well defined R/T curves
Suitable for reflow soldering only
RoHS-compatible
Options
Other electrical parameters on request
Delivery mode
Cardboard tape, 180-mm reel with 8-mm
tape, taping to IEC 60286-3
Dimensional drawing
Dimensions in mm
Geometry of solder pad
Recommended maximum dimensions (mm)
General technical data
Max. operating voltage
Tolerance of R
R
Operating temperature range
Electrical specifications and ordering codes
T
sense
R
R
°C
55
70
85
105
Ω
470
110
470
470
R
R
T
(T
sense
5
°C)
(T
sense
+5
°C)
(@ 2
kΩ
kΩ
°C
< 4.7
< 1.1
< 4.7
< 4.7
> 4.7
> 1.1
> 4.7
> 4.7
45
±5
57
±3
75
±5
95
±5
T
R
R
) (typ.) (@
R
min
)
°C
5
15
40
55
T
op,max
Ordering code
°C
105
115
125
145
B59603A0055A062
B59602A0055B062
B59603A0085A062
B59603A0105A062
V
max
∆R
R
T
op,min
32
±15
40
V DC
%
°C
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 2 of 10
Thermal management in LED driver circuits
EIA case size 0603
Reliability data
Test
Electrical endurance,
constant at 85
°C
Damp heat
Standard
IEC 60738-1
Test conditions
Storage at V
max
/T
op,max
(V
max
)
T = 85
°C
Test duration: 1000 h
Temperature of air: 40
°C
Relative humidity of air: 93%
Duration: 56 days
Test according to IEC 60068-2-78
T
1
= T
op,min
(0 V), T
2
= T
op,max
(0 V)
Number of cycles: 5
Test duration: 30 min
Test according to IEC 60068-2-14, Test Na
Frequency: 10 to 55 Hz
Displacement amplitude: 0.75 mm
Test duration: 3
×
2 h
Test according to IEC 60068-2-6, Test Fc
Acceleration: 390 m/s
2
Pulse duration: 6 ms; 6
×
4000 pulses
Dry heat: T = T
op,max
(0 V)
Test duration: 16 h
Damp heat first cycle
Cold: T = T
op,min
(0 V)
Test duration: 2 h
Damp heat 5 cycles
Tests performed according to
IEC 60068-2-30
Components reflow-soldered to test board
Maximum bending: 2 mm
A shear force of 5 N is applied
perpendicular to the longitudinal axis of the
component which is soldered on PCB.
∆R
25
/R
25
< 25%
IEC 60738-1
< 10%
Rapid change
of temperature
IEC 60738-1
< 10%
Vibration
IEC 60738-1
< 5%
Shock
Climatic sequence
IEC 60738-1
IEC 60738-1
< 5%
< 10%
Bending test
Adhesive strength on
PCB
EN 130000/4.35
< 10%
No visible
damage
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 3 of 10
Thermal management in LED driver circuits
EIA case size 0603
Characteristics (typical) for type A602 and A603
PTC resistance R
PTC
versus PTC temperature T
PTC
(measured at low signal voltage)
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 4 of 10
Thermal management in LED driver circuits
EIA case size 0603
Characteristics (typical) for type A603
PTC resistance R
PTC
versus PTC temperature T
PTC
(measured at low signal voltage)
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 5 of 10
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