Multilayer ceramic capacitor
X7R
Series/Type:
Chip
Ordering code: B37921...
Date:
2005-12-05
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Identification/Classification 1: (header 1)
Identification/Classification 2: (header 2)
Ordering code:
Series/Type:
Preliminary data (optional): (if necessary)
Department:
Date:
Prepared by:
Release signed PE:
Release signed QS:
Modifications/Remarks:
KB VS PE
25.10.2005
Mr. Huainig
Dr. Engel
Dr. Slakhorst
xx
xx
xx
Multilayer ceramic capacitor
HighCV, X7R 1206 50 V
B37872K5105K0**
Chip
©
EPCOS AG 2005. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
Multilayer ceramic capacitors
X7R
Features
■
■
■
■
Chip
High volumetric efficiency
Non-linear capacitance change
High insulation resistance
High pulse strength
Applications
■
Blocking and coupling
■
Decoupling
■
Interference suppression
Termination
■
For soldering: Nickel-barrier termination (Ni) for case sizes 0402 to 1210
Silver-palladium termination (AgPd) for case sizes 1812 and 2220
(capacitance values
≤1 μF)
■
For conductive adhesion: Silver-palladium termination (AgPd) for all case sizes on request
Options
■
Alternative capacitance tolerances available on request
Delivery mode
■
Cardboard and blister tape (blister tape for chip thickness
≥1.2 ±0.1
mm and case sizes
≥1210),
180-mm and 330-mm reel available
■
Bulk case for case sizes 0603 (16 V, 25 V, 50 V) and 0805 (50 V)
Electrical data
Temperature characteristic
Climatic category (IEC 60068-1)
Standard
Dielectric
Rated voltage
1)
Test voltage
Capacitance range
2)
/ E series
Max. relative capacitance change
Dissipation factor (limit value)
Insulation resistance
3)
at + 25
°C
Insulation resistance
3)
at +125
°C
Time constant
3)
at + 25
°C
Time constant
3)
at +125
°C
Operating temperature range
Ageing
4)
1) Note: No operation on AC line.
2) See also HighCap series in data book or Internet
V
R
V
test
C
R
ΔC/C
tan
δ
R
ins
R
ins
τ
τ
T
op
X7R
55/125/56
EIA
Class 2
10, 16, 25, 50,100, 200, 500
2.5 ·
V
R
/5 s
100 pF … 1 µF (E3/E6)
±15
<25 · 10
–3
<35 · 10
–3
for 16 V
>10
5
>10
4
>1000
>100
–55 … +125
yes
VDC
VDC
%
MΩ
MΩ
s
s
°C
3) For
C
R
>10 nF the time constant
τ
=
C
·
R
ins
is given.
4) Refer to data book 2003 “General Techn. Inform.”, page 197.
Please read
Cautions and warnings
and
2
Important notes
at the end of this document.
2
2
12/0505
Multilayer ceramic capacitors
X7R
Recommended solder pad
D
X7R
C
A
KKE0308-1
Maximum dimensions (mm)
Case size
(inch/mm)
0402/1005
0603/1608
0805/2012
1206/3216
1210/3225
1812/4532
2220/5750
Type
single chip
single chip
single chip
single chip
single chip
single chip
single chip
A
0.6
1.0
1.2
1.2
1.2
1.5
1.5
C
1.7
3.0
3.4
4.5
4.5
6.0
7.2
D
0.6
1.0
1.3
1.8
2.8
3.6
5.5
Termination
Ceramic body
Termination
(nickel barrier)
Inner electrode
NME
AgPd
BME
Ni
Substrate electrode
Intermediate electrode
External electrode
NME
Ag
Ni
Sn
BME
Cu
Ni
Sn
NME: Noble Metal Electrode
BME: Base Metal Electrode
KKE0485-5-E
Please read
Cautions and warnings
and
Important notes
at the end of this document.
4
12/05
X7R
Multilayer ceramic capacitors
X7R
Product range chip capacitors
X7R
Size
1)
inch
mm
Type
V
R
(VDC)
C
R
100
150
220
330
470
680
pF
pF
pF
pF
pF
pF
0402
1005
B37921
10
16
25
50
10
16
0603
1608
B37931
25
50
100
1.0 nF
1.5 nF
2.2 nF
3.3 nF
4.7 nF
6.8 nF
10
15
22
33
47
68
100
150
220
nF
nF
nF
nF
nF
nF
nF
nF
nF
2)
2)
2)
1) l
×
b (inch) / l
×
b (mm)
2) See HighCV product range.
Please read
Cautions and warnings
and
Important notes
at the end of this document.
5
12/05
FPGA/CPLD
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