5962-9461203HXX datasheet, PDF

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5962-9461203HXX: DescriptionFlash Module, 512KX32, 90ns, CPGA66, 1.080 X 1.080 INCH, 0.160 INCH HEIGHT, HERMETIC SEALED, CERAMIC, PGA-66; Categorystorage storage; File Size239KB，20 Pages; ManufacturerCobham Semiconductor Solutions

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5962-9461203HXX Overview

Flash Module, 512KX32, 90ns, CPGA66, 1.080 X 1.080 INCH, 0.160 INCH HEIGHT, HERMETIC SEALED, CERAMIC, PGA-66

5962-9461203HXX Parametric

Parameter Name	Attribute value
Maker	Cobham Semiconductor Solutions
Parts packaging code	PGA
package instruction	1.080 X 1.080 INCH, 0.160 INCH HEIGHT, HERMETIC SEALED, CERAMIC, PGA-66
Contacts	66
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Is Samacsys	N
Maximum access time	90 ns
Other features	USER CONFIGURABLE AS 2M X 8
Spare memory width	16
JESD-30 code	S-CPGA-P66
memory density	16777216 bit
Memory IC Type	FLASH MODULE
memory width	32
Number of functions	1
Number of terminals	66
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX32
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Programming voltage	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	4.064 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
type	NOR TYPE
Base Number Matches	1

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ACT–F512K32 High Speed

16 Megabit FLASH Multichip Module

CIRCUIT TECHNOLOGY

Features

■

4 Low Power 512K x 8 FLASH Die in One MCM

www.aeroflex.com

Package

■

TTL Compatible Inputs and CMOS Outputs

■

Access Times of 60, 70, 90, 120 and 150ns

■

+5V Programing, 5V ±10% Supply

■

100,000 Erase/Program Cycles

■

Low Standby Current

■

Page Program Operation and Internal Program

Control Time

■

Sector Architecture (Each Die)

●

8 Equal size sectors of 64K bytes each

●

Any Combination of Sectors can be erased with

one command sequence

●

Supports full chip erase

■

Embedded Erase and Program Algorithms

■

MIL-PRF-38534 Compliant MCMs Available

■

Industry Standard Pinouts

■

Packaging – Hermetic Ceramic

68 Lead, .88" x .88" x .160" Single-Cavity Small

Outline gull wing, Aeroflex code# "F5"

(Drops into

the 68 Lead JEDEC .99"SQ CQFJ footprint)

●

66 Pin, 1.08" x 1.08" x .160" PGA Type, No

Shoulder, Aeroflex code# "P3"

●

66 Pin, 1.08" x 1.08" x .185" PGA Type, With

Shoulder, Aeroflex code# "P7"

■

Internal Decoupling Capacitors for Low Noise

Operation

■

Commercial, Industrial and Military Temperature

Ranges

■

DESC SMD# 5962–94612

Released (P3,P7,F5)

●

Block Diagram – PGA Type Package(P3,P7) & CQFP(F5)

General Description

The ACT–F512K32 is a high

speed, 16 megabit CMOS flash

multichip

module

(MCM)

designed for full temperature

range military, space, or high

reliability applications.

The MCM can be organized

as a 512K x 32bits, 1M x 16bits

or 2M x 8bits device and is input

TTL

and

output

CMOS

compatible.

The

command

WE to a logic low level (V

while CE is low and OE is at

logic high level (V

)

. Reading is

accomplished by chip Enable

(CE) and Output Enable (OE)

being logically active, see

Figure 9. Access time grades of

60ns, 70ns, 90ns, 120ns and

150ns maximum are standard.

The

ACT–F512K32

packaged in a hermetically

–

512Kx8

I/O

0-7

I/O

8-15

I/O

16-23

I/O

24-31

Pin Description

I/O

0-31

Data I/O

0–18

Address Inputs

1-4

Write Enables

1-4

GND

Chip Enables

Output Enable

Power Supply

Ground

Not Connected

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