EEWORLDEEWORLDEEWORLD

Part Number

Search

50295-3053FDLF

Description
Board Connector, 212 Contact(s), 4 Row(s), Female, Right Angle, 0.1 inch Pitch, Solder Terminal, Guide Pin, Black Insulator, Receptacle, LEAD FREE
CategoryThe connector    The connector   
File Size446KB,5 Pages
ManufacturerAmphenol
Websitehttp://www.amphenol.com/
Environmental Compliance
Download Datasheet Parametric View All

50295-3053FDLF Overview

Board Connector, 212 Contact(s), 4 Row(s), Female, Right Angle, 0.1 inch Pitch, Solder Terminal, Guide Pin, Black Insulator, Receptacle, LEAD FREE

50295-3053FDLF Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerAmphenol
package instructionLEAD FREE
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
body width0.46 inch
subject depth0.82 inch
body length5.33 inch
Body/casing typeRECEPTACLE
Connector typeBOARD CONNECTOR
Contact to complete cooperationGOLD (50)
Contact completed and terminatedTin (Sn)
Contact point genderFEMALE
Contact materialBERYLLIUM COPPER
contact modeRECTANGULAR
Contact styleSQ PIN-SKT
DIN complianceNO
Filter functionNO
IEC complianceNO
Insulator colorBLACK
insulator materialGLASS FILLED THERMOPLASTIC
JESD-609 codee3
MIL complianceNO
Manufacturer's serial number50295
Plug contact pitch0.1 inch
Match contact row spacing0.1 inch
Mixed contactsNO
Installation option 1GUIDE PIN
Installation option 2LOCKING
Installation methodRIGHT ANGLE
Installation typeBOARD
Number of connectorsONE
PCB row number4
Number of rows loaded4
OptionsGENERAL PURPOSE
PCB contact patternRECTANGULAR
PCB contact row spacing2.54 mm
Plating thickness50u inch
polarization keyPOLARIZED HOUSING
GuidelineUL
reliabilityCOMMERCIAL
Terminal length0.145 inch
Terminal pitch2.54 mm
Termination typeSOLDER
Total number of contacts212
UL Flammability Code94V-0
Base Number Matches1
PDM: Rev:S
STATUS:
Released
Printed: May 13, 2011
.
【BLE 5.3 wireless MCU CH582】14. BLE serial port transparent transmission test
Series of articles: 【BLE 5.3 wireless MCU CH582】1. Getting to know the CH582 development board (unboxing) 【BLE 5.3 wireless MCU CH582】2. MounRiver IDE first experience 【BLE 5.3 wireless MCU CH582】3. N...
freeelectron Domestic Chip Exchange
Design and implementation of FIR filter based on DSP
[size=4]I. Abstract[/size] [size=4] Using DSP for FIR algorithm[/size] [size=4] [/size] [size=4]II. Experimental platform[/size] [size=4] Matlab7.1 + CCS3.1[/size] [size=4] [/size] [size=4]III. Experi...
Jacktang DSP and ARM Processors
【Transfer】Electronic Design Competition Process
[i=s]This post was last edited by paulhyde on 2014-9-15 09:06[/i] [size=4][color=blue]Pre-competition preparation:[/color] 1. Ability to work all night. 2. Ability to learn quickly. 3. Ability to coor...
open82977352 Electronics Design Contest
MCU Hardware Anti-interference Experience
2006-12-27 14:52:00 Source: China Power Grid  When developing electronic products with processors, how to improve anti-interference ability and electromagnetic compatibility? 1. The following systems ...
fighting Energy Infrastructure?
Use 1117 solar panels
A while ago, I bought a solar panel that can be fixed to a backpack and has a USB power output.Generally, solar power chips need to support MPPT function to improve efficiency, so I took it apart to s...
dcexpert Energy Infrastructure?
Implementation of asynchronous serial port.zip
...
至芯科技FPGA大牛 FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1023  1635  2120  2726  1540  21  33  43  55  32 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号