Radiation-hardened design; total dose irradiation testing to
MIL-STD-883 Method 1019
- Total-dose: 300 krad(Si) and 1Mrad(Si)
- Latchup immune (LET > 100 MeV-cm
2
/mg)
Packaging options:
- 16-lead flatpack (dual in-line)
Standard Microcircuit Drawing 5962-98651
- QML Q and V compliant part
INTRODUCTION
The UT54LVDS031LV Quad Driver is a quad CMOS
differential line driver designed for applications requiring ultra
low power dissipation and high data rates. The device is
designed to support data rates in excess of 400.0 Mbps (200
MHz) utilizing Low Voltage Differential Signaling (LVDS)
technology.
The UT54LVDS031LV accepts low voltage TTL input levels
and translates them to low voltage (340mV) differential output
signals. In addition, the driver supports a three-state function
that may be used to disable the output stage, disabling the load
current, and thus dropping the device to an ultra low idle power
state.
The UT54LVDS031LV and companion quad line receiver
UT54LVDS032LV provide new alternatives to high power
pseudo-ECL devices for high speed point-to-point interface
applications.
All pins have Cold Spare buffers. These buffers will be high
impedance when V
DD
is tied to V
SS
.
D
IN1
D
OUT1+
D1
D
OUT1-
D
IN2
D
OUT2+
D2
D
OUT2-
D
OUT3+
D3
D
OUT3-
D
OUT4+
D4
D
OUT4-
D
IN3
D
IN4
EN
EN
Figure 1. UT54LVDS031LV Quad Driver Block Diagram
1
APPLICATIONS INFORMATION
The UT54LVDS031LV driver’s intended use is primarily in an
uncomplicated point-to-point configuration as is shown in
Figure 3. This configuration provides a clean signaling
environment for quick edge rates of the drivers. The receiver is
connected to the driver through a balanced media such as a
standard twisted pair cable, a parallel pair cable, or simply PCB
traces. Typically, the characteristic impedance of the media is
in the range of 100Ω. A termination resistor of 100Ω should be
selected to match the media and is located as close to the receiver
input pins as possible. The termination resistor converts the
current sourced by the driver into voltages that are detected by
the receiver. Other configurations are possible such as a multi-
receiver configuration, but the effects of a mid-stream
connector(s), cable stub(s), and other impedance
discontinuities, as well as ground shifting, noise margin limits,
and total termination loading must be taken into account.
D
IN1
D
OUT1+
D
OUT1-
EN
D
OUT2-
D
OUT2+
D
IN2
V
SS
1
2
3
4
5
6
7
8
UT54LVDS031LV
Driver
16
15
14
13
12
11
10
9
V
DD
D
IN4
D
OUT4+
D
OUT4-
EN
D
OUT3-
D
OUT3+
D
IN3
Figure 2. UT54LVDS031LV Pinout
TRUTH TABLE
Enables
EN
L
EN
H
Input
D
IN
X
L
H
Z
L
H
Output
D
OUT+
D
OUT-
Z
H
L
DATA
INPUT
ENABLE
RT 100Ω
1/4 UT54LVDS032LV
+
-
DATA
OUTPUT
1/4 UT54LVDS031LV
All other combinations
of ENABLE inputs
PIN DESCRIPTION
Pin No.
1, 7, 9, 15
2, 6, 10, 14
3, 5, 11, 13
4
12
16
8
Name
D
IN
D
OUT+
D
OUT-
EN
EN
V
DD
V
SS
Figure 3. Point-to-Point Application
Description
Driver input pin, TTL/CMOS
compatible
Non-inverting driver output pin,
LVDS levels
Inverting driver output pin,
LVDS levels
Active high enable pin, OR-ed
with EN
Active low enable pin, OR-ed
with EN
Power supply pin, +3.3V + 0.3V
Ground pin
The UT54LVDS031LV differential line driver is a balanced
current source design. A current mode driver, has a high output
impedance and supplies a constant current for a range of loads
(a voltage mode driver on the other hand supplies a constant
voltage for a range of loads). Current is switched through the
load in one direction to produce a logic state and in the other
direction to produce the other logic state. The current mode
requires
(as discussed above) that a resistive termination be
employed to terminate the signal and to complete the loop as
shown in Figure 3. AC or unterminated configurations are not
allowed. The 3.4mA loop current will develop a differential
voltage of 340mV across the 100Ω termination resistor which
the receiver detects with a 240mV minimum differential noise
margin neglecting resistive line losses (driven signal minus
receiver threshold (340mV - 100mV = 240mV)). The signal is
centered around +1.2V (Driver Offset, V
OS
) with respect to
ground as shown in Figure 4.
Note:
The steady-state voltage
(V
SS
) peak-to-peak swing is twice the differential voltage (V
OD
)
and is typically 680mV.
2
3V
D
IN
D
OUT-
SINGLE-ENDED
D
OUT+
V
0D
0V
V
OH
V
OS
V
OL
+V
OD
0V (DIFF.)
0V
-V
OD
D
OUT+
- D
OUT-
DIFFERENTIAL OUTPUT
Note: The footprint of the UT54LVDS031LV is the same as the
industry standard Quad Differential (RS-422) Driver.
V
SS
Figure 4. Driver Output Levels
The current mode driver provides substantial benefits over
SYMBOL
V
DD
V
I/O
PARAMETER
DC supply voltage
Voltage on any pin during operation
Voltage on any pin during cold spare
T
STG
P
D
T
J
Θ
JC
I
I
Storage temperature
Maximum power dissipation
Maximum junction temperature
2
Thermal resistance, junction-to-case
3
DC input current
LIMITS
-0.3 to 4.0V
-0.3 to (V
DD
+ 0.3V)
-.3 to 4.0V
-65 to +150°C
1.25 W
+150°C
10°C/W
±
10mA
Notes:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the
device at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability and performance.
2. Maximum junction temperature may be increased to +175°C during burn-in and life test.
3. Test per MIL-STD-883, Method 1012.
3
RECOMMENDED OPERATING CONDITIONS
SYMBOL
V
DD
T
C
V
IN
PARAMETER
Positive supply voltage
Case temperature range
DC input voltage
LIMITS
3.0 to 3.6V
-55 to +125°C
0V to V
DD
4
DC ELECTRICAL CHARACTERISTICS
1, 2
(V
DD
= 3.3V + 0.3V; -55°C < T
C
< +125°C)
SYMBOL
V
IH
V
IL
V
OL
V
OH
I
IN
I
CS
V
OD1
∆V
OD1
V
OS
∆V
OS
V
CL3
I
OS2, 3
I
OZ3
I
CCL3
I
CCZ3
PARAMETER
High-level input voltage
Low-level input voltage
Low-level output voltage
High-level output voltage
Input leakage current
Cold Spare Leakage Current
Differential Output Voltage
Change in Magnitude of V
OD
for
Complementary Output States
Offset Voltage
(TTL)
(TTL)
R
L
= 100Ω
R
L
= 100Ω
V
IN
= V
DD
or GND, V
DD
= 3.6V
V
IN
=3.6V, V
DD
=V
SS
R
L
= 100Ω
(figure 5)
R
L
= 100Ω
(figure 5)
Voh + Vol
-
R
L
= 100Ω,
⎛
Vos = --------------------------
⎞
⎝
⎠
2
CONDITION
MIN
2.0
V
SS
0.925
MAX
V
DD
0.8
UNIT
V
V
V
1.650
-10
-20
250
+10
+20
400
35
1.125
1.450
V
µA
µΑ
mV
mV
V
Change in Magnitude of V
OS
for
Complementary Output States
Input clamp voltage
Output Short Circuit Current
R
L
= 100Ω
(figure 5)
I
CL
= +18mA
V
IN
= V
DD
, V
OUT+
= 0V or
V
IN
= GND, V
OUT-
= 0V
EN = 0.8V and EN = 2.0 V,
V
OUT
= 0V or V
DD,
V
DD
= 3.6V
R
L
= 100Ω all channels
V
IN
= V
DD
or V
SS
(all inputs)
D
IN
= V
DD
or V
SS
EN = V
SS
, EN = V
DD
-10
-1.5
25
mV
V
9.0
mA
µΑ
Output Three-State Current
+10
Loaded supply current, drivers
enabled
Loaded supply current, drivers
disabled
mA
18.0
mA
3.0
Notes:
1. Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except differential voltages.
2. Output short circuit current (I
OS
) is specified as magnitude only, minus sign indicates direction only.
I am an undergraduate graduate from a grassroots university, majoring in computer science. I failed the postgraduate entrance examination and would like to participate in embedded system training. I w...
[size=4] [/size] [size=4]The board design seems to have some problems. If the UART port is not plugged into the PC, it can't boot from the SD card at all. The TXD and RXD lights flash violently. I don...
[size=4](1)__delay_cycles() is the delay function of IAR_msp430, which is used for accurate delay. You can write a program as follows: [/size] [size=4]-------------------------------------------------...
#include#define TXBUF_SIZE 32 /*The maximum number of data bytes that can be sent in one frame*/ unsigned char TX_BUFF[TXBUF_SIZE]; /*Transmit buffer*/ unsigned char TX_NUM=0; /*Transmit total bytes v...
[align=left]First of all, you need to have a complete understanding of the board. At least you need to know what functions this board has and how it implements these functions. Below I will give you t...
introduction
With the continuous optimization of surface mount technology (SMT) and the rapid development of chip component manufacturing technology, the application of chip mounters in the el...[Details]
1. Introduction
Automobile pollution is one of the most important issues that people are most concerned about and need to solve urgently. As an important method for detecting automobile exhau...[Details]
This paper designs a dot matrix LED text display screen that is easy to update, expandable, and low-cost. The way to reduce costs is
① Use the Bluetooth data transmission function of mobile ph...[Details]
In recent years, lighting has become an important area that countries around the world are targeting to promote energy conservation and environmental protection. According to statistics, about 20% ...[Details]
introduction
The emergence of high-performance, low-power embedded CPUs and high-reliability network operating systems has made it possible to implement applications with large amounts of comp...[Details]
I. Introduction
Since RS232 has a short communication distance (only 15 meters according to EAT/TAI-232 standard), and can only perform point-to-point communication, it cannot directly f...[Details]
Product series: PB-B-RS232/485 interface (hereinafter sometimes referred to as "interface") is a product in the PROFIBUS bus bridge series.
The main purpose of the bridge series ...[Details]
1 Introduction
Water resources are the basic conditions for human survival and the lifeline of economic development. The reality shows that due to the global shortage of water resources and th...[Details]
PV inverter manufacturer SMA has launched its first DC arc fault circuit interrupter (AFCI) PV inverter and has received UL certification.
The new SunnyBoy AFCI inverter models include 3000-US...[Details]
Digital array radar (DAR) uses digital beam forming (DBF) in both receiving and transmitting modes to achieve flexible distribution and reception of RF signal power in the airspace, obtain excellent t...[Details]
With the advocacy and implementation of the government's Safe City Plan, the security market has increasingly higher requirements for the clarity of surveillance images. Imagine that after a case o...[Details]
TC9012F is a universal CMOS large-scale integrated circuit for infrared remote control signal transmission, suitable for remote control of TV, VTR, laser player and other equipment. In the market, ...[Details]
Continuity test
A variety of devices need to be checked for continuity, including cable assemblies, printed circuit boards, and connectors to ensure that these components have the expected contin...[Details]
Spatial Division Multiplexing (SDM) MIMO processing can significantly improve spectrum efficiency and thus greatly increase the capacity of wireless communication systems. Spatial Division Multip...[Details]
Abstract: The output of high-range acceleration sensor is less than 10 mV under the excitation of small signal. The noise of traditional test system may cover such small voltage signal, so that hig...[Details]