MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Low-Voltage CMOS Quad
2-Input NOR Gate
With 5V-Tolerant Inputs
The MC74LCX02 is a high performance, quad 2–input NOR gate
operating from a 2.7 to 3.6V supply. High impedance TTL compatible
inputs significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance. A VI
specification of 5.5V allows MC74LCX02 inputs to be safely driven from
5V devices.
Current drive capability is 24mA at the outputs.
MC74LCX02
LOW–VOLTAGE CMOS
QUAD 2–INPUT NOR GATE
•
•
•
•
•
•
Designed for 2.7 to 3.6V VCC Operation
5V Tolerant Inputs — Interface Capability With 5V TTL Logic
LVTTL Compatible
LVCMOS Compatible
24mA Balanced Output Sink and Source Capability
14
1
D SUFFIX
PLASTIC SOIC
CASE 751A–03
Near Zero Static Supply Current (10µA) Substantially Reduces System
Power Requirements
•
Latchup Performance Exceeds 500mA
•
ESD Performance: Human Body Model >2000V; Machine Model >200V
Pinout: 14–Lead
(Top View)
VCC
14
O2
13
B2
12
A2
11
O3
10
B3
9
A3
8
14
1
M SUFFIX
PLASTIC SOIC EIAJ
CASE 965–01
14
1
SD SUFFIX
PLASTIC SSOP
CASE 940A–03
14
1
O0
2
A0
3
B0
4
O1
5
A1
6
B1
7
GND
1
DT SUFFIX
PLASTIC TSSOP
CASE 948G–01
LOGIC DIAGRAM
A0
B0
A1
B1
A2
B2
A3
B3
2
1
3
5
4
6
11
13
12
8
10
9
O3
O2
O1
O0
PIN NAMES
Pins
An, Bn
On
Function
Data Inputs
Outputs
FUNCTION TABLE
INPUTS
An
L
L
H
H
Bn
L
H
L
H
OUTPUTS
On
H
L
L
L
11/96
©
Motorola, Inc. 1996
1
REV 1
MC74LCX02
ABSOLUTE MAXIMUM RATINGS*
Symbol
VCC
VI
VO
IIK
IOK
Parameter
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
Value
–0.5 to +7.0
–0.5
≤
VI
≤
+7.0
–0.5
≤
VO
≤
VCC + 0.5
–50
–50
+50
IO
ICC
IGND
TSTG
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current Per Ground Pin
Storage Temperature Range
±50
±100
±100
–65 to +150
Note 1.
VI < GND
VO < GND
VO > VCC
Condition
Unit
V
V
V
mA
mA
mA
mA
mA
mA
°C
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is
not implied.
1. Output in HIGH or LOW State. IO absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VI
VO
IOH
IOL
IOH
IOL
TA
∆t/∆V
Supply Voltage
Input Voltage
Output Voltage
(HIGH or LOW State)
Parameter
Operating
Data Retention Only
Min
2.0
1.5
0
0
Typ
3.3
3.3
Max
3.6
3.6
5.5
VCC
–24
24
–12
12
–40
0
+85
10
Unit
V
V
V
mA
mA
mA
mA
°C
ns/V
HIGH Level Output Current, VCC = 3.0V – 3.6V
LOW Level Output Current, VCC = 3.0V – 3.6V
HIGH Level Output Current, VCC = 2.7V – 3.0V
LOW Level Output Current, VCC = 2.7V – 3.0V
Operating Free–Air Temperature
Input Transition Rise or Fall Rate, VIN from 0.8V to 2.0V,
VCC = 3.0V
DC ELECTRICAL CHARACTERISTICS
TA = –40°C to +85°C
Symbol
VIH
VIL
VOH
Characteristic
HIGH Level Input Voltage (Note 2.)
LOW Level Input Voltage (Note 2.)
HIGH Level Output Voltage
Condition
2.7V
≤
VCC
≤
3.6V
2.7V
≤
VCC
≤
3.6V
2.7V
≤
VCC
≤
3.6V; IOH = –100µA
VCC = 2.7V; IOH = –12mA
VCC = 3.0V; IOH = –18mA
VCC = 3.0V; IOH = –24mA
VOL
LOW Level Output Voltage
2.7V
≤
VCC
≤
3.6V; IOL = 100µA
VCC = 2.7V; IOL= 12mA
VCC = 3.0V; IOL = 16mA
VCC = 3.0V; IOL = 24mA
2. These values of VI are used to test DC electrical characteristics only.
VCC – 0.2
2.2
2.4
2.2
0.2
0.4
0.4
0.55
V
Min
2.0
0.8
Max
Unit
V
V
V
MOTOROLA
2
LCX DATA
BR1339 — REV 3
MC74LCX02
DC ELECTRICAL CHARACTERISTICS
(continued)
TA = –40°C to +85°C
Symbol
II
ICC
∆I
CC
Characteristic
Input Leakage Current
Quiescent Supply Current
Condition
2.7V
≤
VCC
≤
3.6V; 0V
≤
VI
≤
5.5V
2.7
≤
VCC
≤
3.6V; VI = GND or VCC
2.7
≤
VCC
≤
3.6V; 3.6
≤
VI
≤
5.5V
Increase in ICC per Input
2.7
≤
VCC
≤
3.6V; VIH = VCC – 0.6V
Min
Max
±5.0
10
±10
500
Unit
µA
µA
µA
µA
AC CHARACTERISTICS
(tR = tF = 2.5ns; CL = 50pF; RL = 500Ω)
Limits
TA = –40°C to +85°C
VCC = 3.0V to 3.6V
Symbol
tPLH
tPHL
Parameter
Propagation Delay
Input to Output
Waveform
1
Min
1.5
1.5
Max
5.2
5.2
VCC = 2.7V
Max
6.0
6.0
Unit
ns
tOSHL
Output–to–Output Skew
1.0
ns
tOSLH
(Note 3.)
1.0
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (tOSHL) or LOW–to–HIGH (tOSLH); parameter
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25°C
Symbol
VOLP
Characteristic
Dynamic LOW Peak Voltage (Note 4.)
Condition
VCC = 3.3V, CL = 50pF, VIH = 3.3V, VIL = 0V
Min
Typ
0.8
Max
Unit
V
VOLV
Dynamic LOW Valley Voltage (Note 4.)
VCC = 3.3V, CL = 50pF, VIH = 3.3V, VIL = 0V
0.8
V
4. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol
CIN
COUT
CPD
Parameter
Input Capacitance
Output Capacitance
Power Dissipation Capacitance
Condition
VCC = 3.3V, VI = 0V or VCC
VCC = 3.3V, VI = 0V or VCC
10MHz, VCC = 3.3V, VI = 0V or VCC
Typical
7
8
25
Unit
pF
pF
pF
LCX DATA
BR1339 — REV 3
3
MOTOROLA
MC74LCX02
2.7V
An, Bn
1.5V
1.5V
0V
tPHL
On
1.5V
tPLH
VOH
1.5V
VOL
PROPAGATION DELAYS
tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns
Figure 1. AC Waveforms
VCC
PULSE
GENERATOR
RT
DUT
CL
RL
CL = 50pF or equivalent (Includes jig and probe capacitance)
RL = R1 = 500Ω or equivalent
RT = ZOUT of pulse generator (typically 50Ω)
Figure 2. Test Circuit
MOTOROLA
4
LCX DATA
BR1339 — REV 3
MC74LCX02
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
–A
–
14
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–B
–
1
7
P
7
PL
0.25 (0.010)
M
B
M
G
C
R
X 45°
F
SEATING
PLANE
D
14 PL
K
M
M
B
S
J
0.25 (0.010)
T
A
S
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.75
8.55
4.00
3.80
1.75
1.35
0.49
0.35
1.25
0.40
1.27 BSC
0.25
0.19
0.25
0.10
7°
0°
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
7°
0°
0.228 0.244
0.010 0.019
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
---
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10
_
0
_
0.70
0.90
---
1.42
INCHES
MIN
MAX
---
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10
_
0
_
0.028
0.035
---
0.056
14
8
LE
Q1
E HE
M
_
L
DETAIL P
1
7
Z
D
e
A
VIEW P
c
b
0.13 (0.005)
M
A1
0.10 (0.004)
LCX DATA
BR1339 — REV 3
5
MOTOROLA
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