Gate, DTL, PDIP14,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Motorola ( NXP ) |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| JESD-30 code | R-PDIP-T14 |
| JESD-609 code | e0 |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | DTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| MC833P | MC833G | MC849G | MC951F | |
|---|---|---|---|---|
| Description | Gate, DTL, PDIP14, | Gate, DTL, MBCY10 | NAND Gate, TTL/H/L Series, 4-Func, 2-Input, TTL, MBCY10, METAL CAN, TO-100, 10 PIN | Monostable Multivibrator, MC95 Series, 1-Func, DTL, CDFP14, CERAMIC, DFP-14 |
| Maker | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| package instruction | DIP, DIP14,.3 | , CAN10,.23 | TO-100, | DFP, FL14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDIP-T14 | O-MBCY-W10 | O-MBCY-W10 | R-GDFP-F14 |
| Number of terminals | 14 | 10 | 10 | 14 |
| Maximum operating temperature | 70 °C | 70 °C | 75 °C | 125 °C |
| Package body material | PLASTIC/EPOXY | METAL | METAL | CERAMIC, GLASS-SEALED |
| Package shape | RECTANGULAR | ROUND | ROUND | RECTANGULAR |
| Package form | IN-LINE | CYLINDRICAL | CYLINDRICAL | FLATPACK |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| technology | DTL | DTL | TTL | DTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL EXTENDED | MILITARY |
| Terminal form | THROUGH-HOLE | WIRE | WIRE | FLAT |
| Terminal location | DUAL | BOTTOM | BOTTOM | DUAL |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible |
| JESD-609 code | e0 | e0 | - | e0 |
| encapsulated code | DIP | - | TO-100 | DFP |
| Encapsulate equivalent code | DIP14,.3 | CAN10,.23 | - | FL14,.3 |
| surface mount | NO | - | NO | YES |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
京公网安备 11010802033920号
EEWORLD
