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BR211SM-260

Description
Breakover Diode, 260 V, SYMMETRICAL BOD
CategoryAnalog mixed-signal IC    Trigger device   
File Size32KB,6 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

BR211SM-260 Overview

Breakover Diode, 260 V, SYMMETRICAL BOD

BR211SM-260 Parametric

Parameter NameAttribute value
MakerNXP
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum breakover voltage260 V
Minimum breakover voltage228 V
ConfigurationSINGLE
Nominal holding current150 mA
JESD-30 codeR-PDSO-C2
Maximum non-repetitive peak forward current40 A
Number of components1
Number of terminals2
Maximum operating temperature70 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Certification statusNot Qualified
surface mountYES
Terminal formC BEND
Terminal locationDUAL
Trigger device typeSYMMETRICAL BOD
Philips Semiconductors
Preliminary specification
Breakover diodes
BR211SM series
GENERAL DESCRIPTION
A range of bidirectional, breakover
diodes in a two terminal, surface
mounting, plastic envelope. These
devices feature controlled breakover
voltage and high holding current
together with high peak current
handling
capability.
Typical
application is transient overvoltage
protection in telecommunications
equipment.
QUICK REFERENCE DATA
SYMBOL
V
(BO)
I
H
I
TSM
PARAMETER
BR211SM-140 to BR211SM-280
Breakover voltage
Holding current
Non-repetitive peak current
MIN.
140
150
-
MAX.
280
-
40
UNIT
V
mA
A
OUTLINE - SOD106
SYMBOL
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL
V
D
I
TSM1
I
TSM2
I
2
t
dI
T
/dt
P
tot
P
TM
T
stg
T
a
T
vj
PARAMETER
Continuous voltage
Non repetitive peak current
Non repetitive on-state current
I
2
t for fusing
Rate of rise of on-state current
after V
(BO)
turn-on
Continuous dissipation
Peak dissipation
Storage temperature
Operating ambient temperature
Overload junction temperature
10/320
µs
impulse equivalent to
10/700
µs,
1.6 kV voltage impulse
(CCITT K17)
half sine wave; t = 10 ms;
T
j
= 70 ˚C prior to surge
t
p
= 10 ms
t
p
= 10
µs
T
a
= 25˚C
t
p
= 1 ms; T
a
= 25˚C
off-state
on-state
CONDITIONS
MIN.
-
-
-
-
-
-
-
- 40
-
-
MAX.
75% of
V
(BO)typ
40
15
1.1
50
1.2
50
150
70
150
UNIT
V
A
A
A
2
s
A/µs
W
W
˚C
˚C
˚C
THERMAL RESISTANCES
SYMBOL
R
th j-sp
R
th j-a
Z
th j-a
PARAMETER
Thermal resistance junction to
solder point
Thermal resistance junction to
ambient
Thermal impedance junction to
ambient
CONDITIONS
MIN.
-
pcb mounted; minimum footprint
t
p
= 1 ms
-
-
TYP.
-
100
2.62
MAX.
12
-
-
UNIT
K/W
K/W
K/W
August 1996
1
Rev 1.100

BR211SM-260 Related Products

BR211SM-260 BR211SM-140 BR211SM-160 BR211SM-180 BR211SM-200 BR211SM-220 BR211SM-240 BR211SM-280
Description Breakover Diode, 260 V, SYMMETRICAL BOD Breakover Diode, 140 V, SYMMETRICAL BOD Breakover Diode, 160 V, SYMMETRICAL BOD Breakover Diode, 180 V, SYMMETRICAL BOD Breakover Diode, 200 V, SYMMETRICAL BOD Breakover Diode, 220 V, SYMMETRICAL BOD Breakover Diode, 240 V, SYMMETRICAL BOD Breakover Diode, 280 V, SYMMETRICAL BOD
Maker NXP NXP NXP NXP NXP NXP NXP NXP
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum breakover voltage 260 V 140 V 160 V 180 V 200 V 220 V 240 V 280 V
Minimum breakover voltage 228 V 123 V 140 V 158 V 176 V 193 V 211 V 246 V
Configuration SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
Nominal holding current 150 mA 150 mA 150 mA 150 mA 150 mA 150 mA 150 mA 150 mA
JESD-30 code R-PDSO-C2 R-PDSO-C2 R-PDSO-C2 R-PDSO-C2 R-PDSO-C2 R-PDSO-C2 R-PDSO-C2 R-PDSO-C2
Maximum non-repetitive peak forward current 40 A 40 A 40 A 40 A 40 A 40 A 40 A 40 A
Number of components 1 1 1 1 1 1 1 1
Number of terminals 2 2 2 2 2 2 2 2
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES YES YES YES YES YES YES
Terminal form C BEND C BEND C BEND C BEND C BEND C BEND C BEND C BEND
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Trigger device type SYMMETRICAL BOD SYMMETRICAL BOD SYMMETRICAL BOD SYMMETRICAL BOD SYMMETRICAL BOD SYMMETRICAL BOD SYMMETRICAL BOD SYMMETRICAL BOD
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