IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | DIP, DIP8,.3 |
| Reach Compliance Code | unknown |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| frequency compensation | YES |
| Maximum input offset voltage | 9000 µV |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| low-dissonance | NO |
| Number of functions | 2 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | +-1.5/+-15/3/30 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| LM358NDS | MC1558SU | MC1558G | |
|---|---|---|---|
| Description | IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,PLASTIC | IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,CERAMIC | IC,OP-AMP,DUAL,BIPOLAR,CAN,8PIN,METAL |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP8,.3 | DIP, DIP8,.3 | , CAN8,.2 |
| Reach Compliance Code | unknown | unknown | unknow |
| Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| frequency compensation | YES | YES | YES |
| Maximum input offset voltage | 9000 µV | 6000 µV | 6000 µV |
| JESD-30 code | R-PDIP-T8 | R-XDIP-T8 | O-MBCY-W8 |
| JESD-609 code | e0 | e0 | e0 |
| low-dissonance | NO | NO | NO |
| Number of functions | 2 | 2 | 2 |
| Number of terminals | 8 | 8 | 8 |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | -55 °C | -55 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | METAL |
| Encapsulate equivalent code | DIP8,.3 | DIP8,.3 | CAN8,.2 |
| Package shape | RECTANGULAR | RECTANGULAR | ROUND |
| Package form | IN-LINE | IN-LINE | CYLINDRICAL |
| power supply | +-1.5/+-15/3/30 V | +-15 V | +-15 V |
| surface mount | NO | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | WIRE |
| Terminal location | DUAL | DUAL | BOTTOM |
| Maker | NXP | - | NXP |
| encapsulated code | DIP | DIP | - |
| Terminal pitch | 2.54 mm | 2.54 mm | - |
| Maximum average bias current (IIB) | - | 0.5 µA | 0.5 µA |
| Nominal Common Mode Rejection Ratio | - | 90 dB | 90 dB |
| Nominal Negative Supply Voltage (Vsup) | - | -15 V | -15 V |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | - | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | - | 15 V | 15 V |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED |
| Nominal Uniform Gain Bandwidth | - | 1000 kHz | 1100 kHz |
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