LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB
ISP/IAP flash with 10-bit ADC and DAC
Rev. 5.1 — 29 July 2011
Product data sheet
1. General description
The LPC2131/32/34/36/38 microcontrollers are based on a 16/32-bit ARM7TDMI-S CPU
with real-time emulation and embedded trace support, that combine the microcontroller
with 32 kB, 64 kB, 128 kB, 256 kB and 512 kB of embedded high-speed flash memory. A
128-bit wide memory interface and a unique accelerator architecture enable 32-bit code
execution at maximum clock rate. For critical code size applications, the alternative 16-bit
Thumb mode reduces code by more than 30 % with minimal performance penalty.
Due to their tiny size and low power consumption, these microcontrollers are ideal for
applications where miniaturization is a key requirement, such as access control and
point-of-sale. With a wide range of serial communications interfaces and on-chip SRAM
options of 8 kB, 16 kB, and 32 kB, they are very well suited for communication gateways
and protocol converters, soft modems, voice recognition and low-end imaging, providing
both large buffer size and high processing power. Various 32-bit timers, single or dual
10-bit 8-channel ADC(s), 10-bit DAC, PWM channels and 47 GPIO lines with up to nine
edge or level sensitive external interrupt pins make these microcontrollers particularly
suitable for industrial control and medical systems.
2. Features and benefits
2.1 Enhancements brought by LPC213x/01 devices
Fast GPIO ports enable port pin toggling up to 3.5 times faster than the original
LPC213x. They also allow for a port pin to be read at any time regardless of its
function.
Dedicated result registers for ADC(s) reduce interrupt overhead.
UART0/1 include fractional baud rate generator, auto-bauding capabilities and
handshake flow-control fully implemented in hardware.
Additional BOD control enables further reduction of power consumption.
2.2 Key features common for LPC213x and LPC213x/01
16/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 or HVQFN64 package.
8/16/32 kB of on-chip static RAM and 32/64/128/256/512 kB of on-chip flash program
memory. 128-bit wide interface/accelerator enables high-speed 60 MHz operation.
In-System Programming/In-Application Programming (ISP/IAP) via on-chip bootloader
software. Single flash sector or full chip erase in 400 ms and programming of 256 B in
1 ms.
EmbeddedICE RT and Embedded Trace interfaces offer real-time debugging with the
on-chip RealMonitor software and high-speed tracing of instruction execution.
NXP Semiconductors
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
One (LPC2131/32) or two (LPC2134/36/38) 8-channel 10-bit ADCs provide a total of
up to 16 analog inputs, with conversion times as low as 2.44
s
per channel.
Single 10-bit DAC provides variable analog output (LPC2132/34/36/38).
Two 32-bit timers/external event counters (with four capture and four compare
channels each), PWM unit (six outputs) and watchdog.
Low power Real-time clock with independent power and dedicated 32 kHz clock input.
Multiple serial interfaces including two UARTs (16C550), two Fast I
2
C-bus (400 kbit/s),
SPI and SSP with buffering and variable data length capabilities.
Vectored interrupt controller with configurable priorities and vector addresses.
Up to forty-seven 5 V tolerant general purpose I/O pins in tiny LQFP64 or HVQFN
package.
Up to nine edge or level sensitive external interrupt pins available.
60 MHz maximum CPU clock available from programmable on-chip PLL with settling
time of 100
s.
On-chip integrated oscillator operates with external crystal in range of 1 MHz to
30 MHz and with external oscillator up to 50 MHz.
Power saving modes include Idle and Power-down.
Individual enable/disable of peripheral functions as well as peripheral clock scaling
down for additional power optimization.
Processor wake-up from Power-down mode via external interrupt or BOD.
Single power supply chip with POR and BOD circuits:
CPU operating voltage range of 3.0 V to 3.6 V (3.3 V
10 %) with 5 V tolerant I/O
pads.
3. Ordering information
Table 1.
Ordering information
Package
Name
LPC2131FBD64/01
LPC2132FBD64/01
LQFP64
LQFP64
Description
plastic low profile quad flat package; 64 leads;
body 10
10
1.4 mm
plastic low profile quad flat package; 64 leads;
body 10
10
1.4 mm
Version
SOT314-2
SOT314-2
SOT804-2
Type number
LPC2132FHN64/01 HVQFN64 plastic thermal enhanced very thin quad flat
package; no leads; 64 terminals; body
9
9
0.85 mm
LPC2134FBD64/01
LPC2136FBD64/01
LPC2138FBD64/01
LQFP64
LQFP64
LQFP64
plastic low profile quad flat package; 64 leads;
body 10
10
1.4 mm
plastic low profile quad flat package; 64 leads;
body 10
10
1.4 mm
plastic low profile quad flat package; 64 leads;
body 10
10
1.4 mm
SOT314-2
SOT314-2
SOT314-2
SOT804-2
LPC2138FHN64/01 HVQFN64 plastic thermal enhanced very thin quad flat
package; no leads; 64 terminals; body
9
9
0.85 mm
LPC2131_32_34_36_38
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5.1 — 29 July 2011
2 of 45
NXP Semiconductors
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
3.1 Ordering options
Table 2.
Ordering options
Flash
RAM
memory
32 kB
64 kB
64 kB
128 kB
256 kB
512 kB
512 kB
8 kB
ADC
DAC
Enhanced UARTs,
Temperature
ADC, Fast I/Os, and range
BOD
yes
yes
yes
yes
yes
yes
yes
40 C
to +85
C
40 C
to +85
C
40 C
to +85
C
40 C
to +85
C
40 C
to +85
C
40 C
to +85
C
40 C
to +85
C
Type number
LPC2131FBD64/01
LPC2132FBD64/01
LPC2132FHN64/01
LPC2134FBD64/01
LPC2136FBD64/01
LPC2138FBD64/01
LPC2138FHN64/01
1
-
1
1
1
1
1
1
16 kB 1
16 kB 1
16 kB 2
32 kB 2
32 kB 2
32 kB 2
LPC2131_32_34_36_38
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5.1 — 29 July 2011
3 of 45
NXP Semiconductors
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
4. Block diagram
TMS
(3)
TRST
(3)
TDI
(3)
trace
TCK
(3)
TDO
(3)
signals
XTAL2
RESET
XTAL1
EMULATION
TRACE MODULE
LPC2131, LPC2131/01
LPC2132, LPC2132/01
LPC2134, LPC2134/01
LPC2136, LPC2136/01
LPC2138, LPC2138/01
P0[31:0]
P1[31:16]
FAST GENERAL
PURPOSE I/O
TEST/DEBUG
INTERFACE
PLL
system
clock
SYSTEM
FUNCTIONS
VECTORED
INTERRUPT
CONTROLLER
ARM7TDMI-S
AHB BRIDGE
ARM7 local bus
INTERNAL
SRAM
CONTROLLER
INTERNAL
FLASH
CONTROLLER
AMBA AHB
(Advanced High-performance Bus)
AHB
DECODER
AHB TO APB
BRIDGE
APB
DIVIDER
8/16/32 kB
SRAM
32/64/128/
256/512 kB
FLASH
APB (ARM
peripheral bus)
EINT[3:0]
EXTERNAL
INTERRUPTS
I
2
C SERIAL
INTERFACES 0 AND 1
SCL0,1
SDA0,1
SCK0,1
MOSI0,1
MISO0,1
SSEL0,1
TXD0,1
RXD0,1
DSR1
(1)
,CTS1
(1)
RTS1
(1)
, DTR1
(1)
DCD1
(1)
, RI1
(1)
RTCX1
P0[31:0]
P1[31:16]
REAL TIME CLOCK
GENERAL
PURPOSE I/O
WATCHDOG
TIMER
PWM[6:1]
PWM0
SYSTEM
CONTROL
RTCX2
VBAT
8
×
CAP
8
×
MAT
AD0[7:0]
AD1[7:0]
(1)
CAPTURE/
COMPARE
TIMER 0/TIMER 1
SPI AND SSP
SERIAL INTERFACES
A/D CONVERTERS
0 AND 1
(1)
UART0/UART1
AOUT
(2)
D/A CONVERTER
(2)
002aab067
(1) LPC2134/36/38 only.
(2) LPC2132/34/36/38 only.
(3) Pins shared with GPIO.
Fig 1. Block diagram
LPC2131_32_34_36_38
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5.1 — 29 July 2011
4 of 45
NXP Semiconductors
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
5. Pinning information
5.1 Pinning
54 P0.19/MAT1.2/MOSI1/CAP1.2
53 P0.18/CAP1.3/MISO1/MAT1.3
55 P0.20/MAT1.3/SSEL1/EINT3
52 P1.30/TMS
64 P1.27/TDO
56 P1.29/TCK
60 P1.28/TDI
57 RESET
62 XTAL1
61 XTAL2
63 VREF
58 P0.23
P0.21/PWM5/CAP1.3
P0.22/CAP0.0/MAT0.0
RTCX1
P1.19/TRACEPKT3
RTCX2
V
SS
V
DDA
P1.18/TRACEPKT2
P0.25/AD0.4
1
2
3
4
5
6
7
8
9
49 VBAT
59 V
SSA
51 V
DD
50 V
SS
48 P1.20/TRACESYNC
47 P0.17/CAP1.2/SCK1/MAT1.2
46 P0.16/EINT0/MAT0.2/CAP0.2
45 P0.15/EINT2
44 P1.21/PIPESTAT0
43 V
DD
42 V
SS
41 P0.14/EINT1/SDA1
40 P1.22/PIPESTAT1
39 P0.13/MAT1.1
38 P0.12/MAT1.0
37 P0.11/CAP1.1/SCL1
36 P1.23/PIPESTAT2
35 P0.10/CAP1.0
34 P0.9/RXD1/PWM6/EINT3
33 P0.8/TXD1/PWM4
LPC2131
LPC2131/01
P0.26/AD0.5 10
P0.27/AD0.0/CAP0.1/MAT0.1 11
P1.17/TRACEPKT1 12
P0.28/AD0.1/CAP0.2/MAT0.2 13
P0.29/AD0.2/CAP0.3/MAT0.3 14
P0.30/AD0.3/EINT3/CAP0.0 15
P1.16/TRACEPKT0 16
P0.31 17
V
SS
18
P0.0/TXD0/PWM1 19
P1.31/TRST 20
P0.1/RXD0/PWM3/EINT0 21
P0.2/SCL0/CAP0.0 22
V
DD
23
P1.26/RTCK 24
V
SS
25
P0.3/SDA0/MAT0.0/EINT1 26
P0.4/SCK0/CAP0.1/AD0.6 27
P1.25/EXTIN0 28
P0.5/MISO0/MAT0.1/AD0.7 29
P0.6/MOSI0/CAP0.2 30
P0.7/SSEL0/PWM2/EINT2 31
P1.24/TRACECLK 32
002aab068
Fig 2. LPC2131 LQFP64 pin configuration
LPC2131_32_34_36_38
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5.1 — 29 July 2011
5 of 45
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