LPC2141/42/44/46/48 - Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC QFP 64-Pin
LPC2141/42/44/46/48 - Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC QFP 64-Pin
LPC2141FBD64,118 Parametric
Parameter Name
Attribute value
Brand Name
NXP Semiconductor
Maker
NXP
Parts packaging code
QFP
package instruction
10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64
LPC2141/42/44/46/48 - Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC QFP 64-Pin
LPC2141/42/44/46/48 - Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC QFP 64-Pin
LPC2141/42/44/46/48 - Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC QFP 64-Pin
LPC2141/42/44/46/48 - Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC QFP 64-Pin
LPC2141/42/44/46/48 - Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC QFP 64-Pin
Brand Name
NXP Semiconductor
NXP Semiconductor
NXP Semiconductor
NXP Semiconductor
NXP Semiconductor
Maker
NXP
NXP
NXP
NXP
NXP
Parts packaging code
QFP
QFP
QFP
QFP
QFP
package instruction
10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64
10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64
10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64
10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64
10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64
10KV switch cabinet transformer trips when no-load power is transmitted. The comprehensive protection shows that the secondary current is 15A. The rated current of the transformer is 116A. What is the...
I am studying the transplantation of UCOS-II on TI's VC33, but I cannot determine the above problems from the 33 data. I would be grateful if experienced experts can give me some advice! ! I have some...
Hello everyone, I have a question that I would like to discuss with you. The memory of the LPC2478 chip I use is 64k . Now I want to allocate a section of memory from it to use as a buffer. What I nee...
Wave soldering is a crucial electronic component soldering technique used in the production of a wide range of electronic devices, from home appliances to computers to avionics. The process is wide...[Details]
A parallel inverter consists of two thyristors (T1 and T2), a capacitor, a center-tapped transformer, and an inductor. The thyristors provide a current path, while the inductor L maintains a consta...[Details]
In recent years, many people have switched to new energy vehicles, and this type of vehicle has indeed been highly sought after and is considered the future direction of automobile development, and...[Details]
Multi-touch mobile phone
Multi-touch is a system that can respond to multiple touches on the screen at the same time. Multi-touch phones are divided into capacitive and resistive types. Capaci...[Details]
Industrial computers with GPUs leverage powerful parallel processing to build deep learning models to analyze and respond to optical inputs. The systems develop an understanding of visual data to i...[Details]
introduction
With the development of the information superhighway and the internet, broadcast television has become increasingly widespread worldwide. Television information has emerged in var...[Details]
Most cameras on the market use chips manufactured by Japanese companies like Sony, Sharp, Panasonic, and LG. South Korea now has the capability to produce chips, but the quality is somewhat inferio...[Details]
Silicon Labs (also known as "Silicon Labs"), an innovative leader in low-power wireless connectivity, will showcase its cutting-edge artificial intelligence (AI) and Internet of Things (IoT) solu...[Details]
Today,
the Intel®
Universal
Quick Connector (UQD) Interchangeability Alliance was officially established
. At the inaugural ceremony, Intel and its first certified partners—Invicta...[Details]
In the wave of electrification and intelligence in the automotive industry, the E/E architecture is transitioning from distributed to domain control and then to regional architecture.
Th...[Details]
At the 2025 KeyBanc Investor Conference,
ON
Semiconductor CEO Hassane S. El-Khoury, framing global industrial transformation as the basis for
his strategic layout in two high-growth sect...[Details]
With the rapid development of the automotive industry, automotive requirements for control, communication, and network management are becoming increasingly stringent. Hardware platforms based on 32...[Details]
Electric vehicles, especially passenger vehicles, don't require a gearbox; instead, they require a fixed-ratio reduction gearbox. This is directly related to the inherent strengths of electric moto...[Details]
Oslo, Norway – August 18, 2025 – Nordic Semiconductor ("Nordic"), a leading global provider of low-power wireless technology, announced that it will participate in the International Internet of Thi...[Details]
introduction
The Internet of Things (IoT) will improve nearly every aspect of modern life. By collecting and analyzing vast amounts of data, it can help us manage our health, reduce energy con...[Details]