|
ADC10D1000CIUT |
ADC10D1500CIUT |
| Description |
10-Bit, Dual 1.0-GSPS or Single 2.0-GSPS Analog-to-Digital Converter (ADC) 292-BGA -40 to 85 |
10-Bit, Dual 1.5-GSPS or Single 3.0-GSPS Analog-to-Digital Converter (ADC) 292-BGA -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
BGA |
BGA |
| package instruction |
HBGA, BGA292,20X20,50 |
HBGA, |
| Contacts |
292 |
292 |
| Reach Compliance Code |
not_compliant |
_compli |
| ECCN code |
3A001.A.5.A.1 |
3A001.A.5.A.2 |
| Factory Lead Time |
1 week |
1 week |
| Converter type |
ADC, DELTA-SIGMA |
ADC, DELTA-SIGMA |
| JESD-30 code |
S-PBGA-B292 |
S-PBGA-B292 |
| JESD-609 code |
e0 |
e0 |
| length |
27 mm |
27 mm |
| Maximum linear error (EL) |
0.1367% |
0.1367% |
| Humidity sensitivity level |
3 |
3 |
| Number of analog input channels |
1 |
1 |
| Number of digits |
10 |
10 |
| Number of functions |
1 |
1 |
| Number of terminals |
292 |
292 |
| Maximum operating temperature |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
| Output bit code |
OFFSET BINARY, 2'S COMPLEMENT BINARY |
OFFSET BINARY, 2'S COMPLEMENT BINARY |
| Output format |
PARALLEL, WORD |
PARALLEL, WORD |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
HBGA |
HBGA |
| Package shape |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, HEAT SINK/SLUG |
GRID ARRAY, HEAT SINK/SLUG |
| Peak Reflow Temperature (Celsius) |
220 |
220 |
| Sampling rate |
2000 MHz |
3000 MHz |
| Sample and hold/Track and hold |
TRACK |
TRACK |
| Maximum seat height |
2.58 mm |
2.58 mm |
| Nominal supply voltage |
1.9 V |
1.9 V |
| surface mount |
YES |
YES |
| technology |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
BALL |
BALL |
| Terminal pitch |
1.27 mm |
1.27 mm |
| Terminal location |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
27 mm |
27 mm |
| Base Number Matches |
1 |
1 |