IC OP-AMP, PDIP8, Operational Amplifier
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| Parts packaging code | DIP |
| package instruction | DIP, DIP8,.3 |
| Contacts | 8 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| frequency compensation | NO |
| Maximum input offset voltage | 7500 µV |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| low-dissonance | NO |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| UA709CN | UA709CT | SA709CN | SA709CN-14 | SA709CF | |
|---|---|---|---|---|---|
| Description | IC OP-AMP, PDIP8, Operational Amplifier | IC OP-AMP, 10000 uV OFFSET-MAX, MBCY8, Operational Amplifier | IC OP-AMP, PDIP8, Operational Amplifier | IC OP-AMP, PDIP14, Operational Amplifier | IC OP-AMP, CDIP14, Operational Amplifier |
| Maker | NXP | NXP | NXP | NXP | NXP |
| Parts packaging code | DIP | BCY | DIP | DIP | DIP |
| Contacts | 8 | 8 | 8 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| JESD-30 code | R-PDIP-T8 | O-MBCY-W8 | R-PDIP-T8 | R-PDIP-T14 | R-CDIP-T14 |
| Number of terminals | 8 | 8 | 8 | 14 | 14 |
| Package body material | PLASTIC/EPOXY | METAL | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| Package shape | RECTANGULAR | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | CYLINDRICAL | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO | NO |
| Terminal form | THROUGH-HOLE | WIRE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | BOTTOM | DUAL | DUAL | DUAL |
京公网安备 11010802033920号
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