KMPC555LFMZP40 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> KMPC555LFMZP40

KMPC555LFMZP40: DescriptionRISC MICROCONTROLLER, PBGA272, PLASTIC, BGA-272; CategoryThe embedded processor and controller Microcontrollers and processors; File Size13MB，962 Pages; ManufacturerMotorola ( NXP ); Websitehttps://www.nxp.com

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KMPC555LFMZP40 Overview

RISC MICROCONTROLLER, PBGA272, PLASTIC, BGA-272

KMPC555LFMZP40 Parametric

Parameter Name	Attribute value
Parts packaging code	BGA
package instruction	BGA,
Contacts	272
Reach Compliance Code	unknown
Other features	ALSO REQUIRES 5V SUPPLY
JESD-30 code	S-PBGA-B272
length	27 mm
Number of terminals	272
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
Maximum seat height	2.65 mm
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	HCMOS
Temperature level	AUTOMOTIVE
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	27 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC
Base Number Matches	1

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KMPC555LFMZP40 Related Products

	KMPC555LFMZP40	MPC555LFAZP40	KMPC555LFCZP40	MPC555LFCZP40	MPC556
Description	RISC MICROCONTROLLER, PBGA272, PLASTIC, BGA-272	32-BIT, FLASH, 40MHz, RISC MICROCONTROLLER, PBGA272, 27 X 27 MM, 2.35 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-272	RISC Microcontroller, HCMOS, PBGA272, PLASTIC, BGA-272	32-BIT, FLASH, 40MHz, RISC MICROCONTROLLER, PBGA272, PLASTIC, BGA-272	32-BIT, FLASH, 40MHz, RISC MICROCONTROLLER, PBGA272, PLASTIC, BGA-272
package instruction	BGA,	BGA,	BGA,	BGA,	BGA,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknow
JESD-30 code	S-PBGA-B272	S-PBGA-B272	S-PBGA-B272	S-PBGA-B272	S-PBGA-B272
Number of terminals	272	272	272	272	272
Maximum operating temperature	125 °C	125 °C	85 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES
technology	HCMOS	HCMOS	HCMOS	HCMOS	HCMOS
Temperature level	AUTOMOTIVE	MILITARY	INDUSTRIAL	AUTOMOTIVE	AUTOMOTIVE
Terminal form	BALL	BALL	BALL	BALL	BALL
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Parts packaging code	BGA	BGA	-	BGA	BGA
Contacts	272	272	-	272	272
Other features	ALSO REQUIRES 5V SUPPLY	ALSO REQUIRES 5V SUPPLY	ALSO REQUIRES 5V SUPPLY	-	-
length	27 mm	27 mm	27 mm	-	-
Maximum seat height	2.65 mm	2.65 mm	2.65 mm	-	-
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	-	-
width	27 mm	27 mm	27 mm	-	-
Base Number Matches	1	1	1	1	-
ECCN code	-	3A001.A.2.C	-	3A991.A.2	3A991.A.2
Has ADC	-	NO	-	NO	NO
Address bus width	-	24	-	24	24
bit size	-	32	-	32	32
maximum clock frequency	-	20 MHz	-	40 MHz	40 MHz
DAC channel	-	NO	-	NO	NO
DMA channel	-	NO	-	NO	NO
External data bus width	-	32	-	32	32
PWM channel	-	YES	-	YES	YES
ROM programmability	-	FLASH	-	FLASH	FLASH
speed	-	40 MHz	-	40 MHz	40 MHz

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