The documentation and process conversion
measures necessary to comply with this revision
shall be completed by 16 November 2004.
INCH-POUND
MIL-PRF-19500/115K
16 August 2004
SUPERSEDING
MIL-PRF-19500/115J
10 October 1997
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, DIODE, SILICON, VOLTAGE REGULATOR, TYPES
1N3821A THROUGH 1N3828A, 1N3016B THROUGH 1N3051B,
1N3821A-1 THROUGH 1N3828A-1, 1N3016B-1 THROUGH 1N3051B-1,
1N3821AUR-1 THROUGH 1N3828AUR-1, 1N3016BUR-1 THROUGH 1N3051BUR-1,
PLUS C- AND D- TOLERANCE SUFFIX,
JAN, JANTX, JANTXV, AND JANHC
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
*
1. SCOPE
1.1 Scope. This specification covers the performance requirements for 1 W, silicon, voltage regulator diodes with
voltage tolerances of 5 percent, 2 percent, and 1 percent. Three levels of product assurance are provided for each
device type as specified in MIL-PRF-19500. One level of product assurance is provided for die.
1.2 Physical dimensions. See figures 1 (DO-13), 2 (DO-41), 3 (DO-213AB), 4, and 5 (for JANHC).
* 1.3 Maximum ratings. Maximum ratings are as shown in maximum test ratings (see 3.8) herein and as follows:
-55°C
≤
Top
≤
+175°C; -55°C
≤
TSTG
≤
+175°C.
Type
DO-13, DO-41
DO-213AB
PT
W
1.0 (1)
1.0 (2)
TL
°C
+95
TEC
°C
+125
The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.
(1) L = .375 inch (9.53 mm). Both ends of case or diode body to heat sink at L = .375 (9.53 mm). (Derate IZ to
0.0 mA dc at TL = +175°C).
(2) Derate to 0 at TEC = +175°C.
* 1.4 Primary electrical characteristics. Primary electrical characteristic are as shown in primary test ratings (see
3.8) herein and as follows: 3.3 V dc≤ Vz
≤
200 V dc. A and B suffix devices are 5 percent voltage tolerance. C suffix
devices are 2 percent voltage tolerance. D suffix devices are 1 percent voltage tolerance.
Type
DO-13
DO-41
DO-213AB
R
θJL
(1)
°C/W
80
50
R
θJEC
(2)
°C/W
50
(1) L = .375 inch (9.53 mm).
(2) Junction to end-caps.
* Comments, suggestions, or questions on this document should be addressed to Defense Supply Center, Columbus,
ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
Semiconductor@dscc.dla.mil.
Since
contact information can change, you may want to verify the currency of this address information using the ASSIST
Online database at
http://www.dodssp.daps.mil.
AMSC N/A
FSC 5961
MIL-PRF-19500/115K
Dimensions
Symbol
Inches
Min
BD
BL
LD
LDU
LL
LL
1
1.000
.21
.215
.195
.026
Max
.265
.350
.035
.110
25.40
5.33
Millimeters
Min
5.46
4.96
0.66
Max
6.73
8.89
0.89
2.79
4
3
Notes
NOTES:
1. Dimensions are in inches.
2. Millimeter equivalents are given for general information only.
3. Dimension BD shall be measured at the largest diameter.
4. Cathode lead shall be electrically connected to the case. If tubulation is used, it shall
be on the anode end.
5. In accordance with ASME Y14.5M, diameters are equivalent to
φx
symbology.
FIGURE 1. Physical dimensions types 1N3821A, C, D through 1N3828A, C, D
and 1N3016B, C, D through 1N3051B, C, D (DO-13).
2
MIL-PRF-19500/115K
Dimensions
Symbol
Inches
Min
BD
BL
LD
LL
LL
1
.080
.160
.028
1.000
.50
Max
.107
.205
.034
Millimeters
Min
2.03
4.06
0.71
25.40
1.27
4
Max
2.72
5.21
0.86
3
3
Notes
NOTES:
1. Dimensions are in inches.
2. Millimeter equivalents are given for general information only.
3. Package contour optional within BD and length BL. Heat slugs, if any, shall be
included within this cylinder but shall not be subject to minimum limit of BD.
4. Within this zone lead, diameter may vary to allow for lead finishes and
irregularities other than heat slugs.
5. In accordance with ASME Y14.5M, diameters are equivalent to
φx
symbology.
FIGURE 2. Physical dimensions types 1N3821A-1, C-1, D-1 through 1N3828A-1, C-1, D-1
and 1N3016B-1, C-1, D-1 through 1N3051B-1, C-1, D-1 (DO-41).
3
MIL-PRF-19500/115K
Dimensions
Symbol
Inches
Min
BD
BL
1
BL
ECT
S
.094
.159
(Ref.)
.189
.014
.001
.205
.022
Max
.105
Millimeters
Min
2.39
4.04
(Ref.)
4.80
0.360
0.030
5.21
0.560
Max
2.67
NOTES:
1. Dimensions are in inches.
2. Millimeter equivalents are given for general information only.
3. Gap not controlled, shape of body and gap not controlled.
4. In accordance with ASME Y14.5M, diameters are equivalent to
φx
symbology.
FIGURE 3. Physical dimensions of surface mount family types 1N3821AUR-1, CUR-1, and DUR-1
through 1N3828AUR-1, CUR-1, DUR-1 and 1N3016BUR-1, CUR-1 and DUR-1 through
1N3051BUR-1, CUR-1 and DUR-1 (DO-213AB).
4
MIL-PRF-19500/115K
A Version
Dimensions
Symbol
Inches
Min
A
B
.035
.031
Max
.039
.033
Millimeters
Min
0.89
0.79
Max
0.99
0.84
NOTES:
1. Dimensions are in inches.
2. Millimeter equivalents are given for general information only.
3. The physical characteristics of the die thickness are .010
±002
(0.25 mm).
Metallization is:
Top (anode) - Al, back (cathode) - Au. Al thickness = 25,000Å minimum,
Au thickness = 4,000Å minimum.
4. In accordance with ASME Y14.5M, diameters are equivalent to
φx
symbology.
FIGURE 4. Physical dimensions JANHCA die.
5
NXP MCU
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