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In recent years, with the application of the IEC61850 standard and the development and deployment of optoelectronic transformers, the concept of digital substations has been put into practical use ...[Details]
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1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
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Through AI connection technology supported by Qualcomm X85 5G modem and RF and Qualcomm FastConnect 7900 mobile connection system, seamless switching can be achieved between cellular net...[Details]
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A human-machine interface (HMI) refers to the platform used by people to operate a PLC. This platform provides an interface between programs and humans, serving as a medium for information transmis...[Details]
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A patent disclosed by Ford proposes replacing traditional segmented side curtain airbags with integrated full-width side curtain airbags that span the side of the vehicle and can be deployed simult...[Details]
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Inverter power supplies on the market can generally be divided into two categories: sine wave inverters and square wave inverters. Some engineers also like to categorize pure sine wave inverters as...[Details]
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Compiled from semiengineering
The industry is increasingly concerned about power consumption in AI, but there are no simple solutions. This requires a deep understanding of software and ...[Details]
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According to the latest financial report data, thanks to its leading position in advanced technology, TSMC's profit performance in the second quarter of 2025 was extremely impressive, with net prof...[Details]
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Shock absorbers, as the name implies, are responsible for cushioning and absorbing shocks in a car. So how much do you know about shock absorbers and how to replace them in electric cars?
...[Details]
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Chip architecture licensing company ARM has hired Amazon's AI chip chief Rami Sinno to help advance its plan to develop its own complete chip, people familiar with the matter said, according to Reu...[Details]
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On August 18, domestic EDA manufacturer HuaDa JiuTian launched the advanced packaging design platform Storm for the first time in the world at the end of July. It claims that the chiplet wiring eff...[Details]
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Black Sesame's full-stack computing platform has been named Singapore's "GO! Technology Ulisation Winner." Designed for real-time AI inference for next-generation robots, the platform has been succ...[Details]
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Recently, Orbbec issued an announcement that its application for issuing A-shares to specific objects in 2025 has been accepted by the Shanghai Stock Exchange.
The announcement shows that the ...[Details]
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On August 18, Indian officials announced on August 12 local time that they had approved four more semiconductor projects under the framework of the Indian Semiconductor Mission (ISM), bringing the ...[Details]
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On August 14, Chinese researchers broke through the bottleneck of energy density and application performance of existing traditional lithium-ion batteries and developed soft-pack batteries with an ...[Details]