SN74LS365A SN74LS367A
SN74LS368A
3-State Hex Buffers
These devices are high speed hex buffers with 3-state outputs. They
are organized as single 6-bit or 2-bit / 4-bit, with inverting or
non-inverting data (D) paths. The outputs are designed to drive 15
TTL Unit Loads or 60 Low Power Schottky loads when the Enable (E)
is LOW.
When the Output Enable (E) is HIGH, the outputs are forced to a
high impedance “off” state. If the outputs of the 3-state devices are tied
together, all but one device must be in the high impedance state to
avoid high currents that would exceed the maximum ratings.
Designers should ensure that Output Enable signals to 3-state devices
whose outputs are tied together are designed so there is no overlap.
GUARANTEED OPERATING RANGES
Symbol
V
CC
T
A
I
OH
I
OL
Parameter
Supply Voltage
Operating Ambient
Temperature Range
Output Current – High
Output Current – Low
Min
4.75
0
Typ
5.0
25
Max
5.25
70
– 2.6
24
Unit
V
°C
mA
mA
16
1
http://onsemi.com
LOW
POWER
SCHOTTKY
PLASTIC
N SUFFIX
CASE 648
16
1
SOIC
D SUFFIX
CASE 751B
ORDERING INFORMATION
Device
SN74LS365AN
SN74LS365AD
SN74LS367AN
SN74LS367AD
SN74LS368AN
SN74LS368AD
Package
16 Pin DIP
16 Pin
16 Pin DIP
16 Pin
16 Pin DIP
16 Pin
Shipping
2000 Units/Box
2500/Tape & Reel
2000 Units/Box
2500/Tape & Reel
2000 Units/Box
2500/Tape & Reel
©
Semiconductor Components Industries, LLC, 1999
1
December, 1999 – Rev. 6
Publication Order Number:
SN74LS365A/D
SN74LS365A SN74LS367A SN74LS368A
PACKAGE DIMENSIONS
–A–
16
9
B
1
8
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0
_
10
_
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0
_
10
_
0.51
1.01
F
S
C
L
–T–
H
G
D
16 PL
SEATING
PLANE
K
J
T A
M
M
0.25 (0.010)
M
–A–
16
9
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–B–
P
8 PL
1
8
0.25 (0.010)
M
B
S
G
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0
_
7
_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0
_
7
_
0.229
0.244
0.010
0.019
K
C
–T–
SEATING
PLANE
R
X 45
_
M
D
16 PL
M
J
0.25 (0.010)
T B
S
A
S
DIM
A
B
C
D
F
G
J
K
M
P
R
ON Semiconductor
and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
North America Literature Fulfillment:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
303–675–2175 or 800–344–3860 Toll Free USA/Canada
Fax:
303–675–2176 or 800–344–3867 Toll Free USA/Canada
Email:
ONlit@hibbertco.com
N. American Technical Support:
800–282–9855 Toll Free USA/Canada
EUROPE:
LDC for ON Semiconductor – European Support
German Phone:
(+1) 303–308–7140 (M–F 2:30pm to 5:00pm Munich Time)
Email:
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(+1) 303–308–7141 (M–F 2:30pm to 5:00pm Toulouse Time)
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English Phone:
(+1) 303–308–7142 (M–F 1:30pm to 5:00pm UK Time)
Email:
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ASIA/PACIFIC:
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Phone:
303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time)
Toll Free from Hong Kong 800–4422–3781
Email:
ONlit–asia@hibbertco.com
JAPAN:
ON Semiconductor, Japan Customer Focus Center
4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–8549
Phone:
81–3–5487–8345
Email:
r14153@onsemi.com
Fax Response Line:
303–675–2167
800–344–3810 Toll Free USA/Canada
ON Semiconductor Website:
http://onsemi.com
For additional information, please contact your local
Sales Representative.
http://onsemi.com
4
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