PEX8532-BB25BIG datasheet, PDF

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PEX8532-BB25BIG: DescriptionPCI Bus Controller, CMOS, PBGA680, 35 X 35 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, BGA-680; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，512 Pages; ManufacturerBroadcom

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PEX8532-BB25BIG Overview

PCI Bus Controller, CMOS, PBGA680, 35 X 35 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, BGA-680

PEX8532-BB25BIG Parametric

Parameter Name	Attribute value
package instruction	HBGA,
Reach Compliance Code	compli
ECCN code	3A001.A.3
Address bus width
maximum clock frequency	100 MHz
Maximum data transfer rate	312.5 MBps
External data bus width
JESD-30 code	S-PBGA-B680
length	35 mm
Number of terminals	680
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HBGA
Package shape	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG
Certification status	Not Qualified
Maximum seat height	2.23 mm
Maximum supply voltage	1.1 V
Minimum supply voltage	0.9 V
Nominal supply voltage	1 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	35 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, PCI
Base Number Matches	1

PEX8532-BB25BIG Related Products

	PEX8532-BB25BIG	PEX8532-BC25BIG	PEX8532-BC25BI	PEX8532-BB25BI
Description	PCI Bus Controller, CMOS, PBGA680, 35 X 35 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, BGA-680	PCI Bus Controller, CMOS, PBGA680, 35 X 35 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, BGA-680	PCI Bus Controller, CMOS, PBGA680, 35 X 35 MM, 2.23 MM HEIGHT, 1 MM PITCH, BGA-680	PCI Bus Controller, CMOS, PBGA680, 35 X 35 MM, 2.23 MM HEIGHT, 1 MM PITCH, BGA-680
package instruction	HBGA,	HBGA,	35 X 35 MM, 2.23 MM HEIGHT, 1 MM PITCH, BGA-680	HBGA,
Reach Compliance Code	compli	compliant	unknown	compliant
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
maximum clock frequency	100 MHz	100 MHz	100 MHz	100 MHz
JESD-30 code	S-PBGA-B680	S-PBGA-B680	S-PBGA-B680	S-PBGA-B680
length	35 mm	35 mm	35 mm	35 mm
Number of terminals	680	680	680	680
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HBGA	HBGA	HBGA	HBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage	1.1 V	1.1 V	1.1 V	1.1 V
Minimum supply voltage	0.9 V	0.9 V	0.9 V	0.9 V
Nominal supply voltage	1 V	1 V	1 V	1 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	35 mm	35 mm	35 mm	35 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, PCI	BUS CONTROLLER, PCI	BUS CONTROLLER, PCI	BUS CONTROLLER, PCI
Maker	-	Broadcom	Broadcom	Broadcom

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