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GD74HC148

Description
Encoder, CMOS, PDIP16,
Categorylogic    logic   
File Size208KB,4 Pages
ManufacturerLG Semicon Co., Ltd.
Download Datasheet Parametric Compare View All

GD74HC148 Overview

Encoder, CMOS, PDIP16,

GD74HC148 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T16
JESD-609 codee0
Logic integrated circuit typeENCODER
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply2/6 V
Certification statusNot Qualified
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

GD74HC148 Related Products

GD74HC148 GD54HCT148J GD54HC148J GD74HC148J GD74HC148D GD74HCT148D GD74HCT148 GD74HCT148J
Description Encoder, CMOS, PDIP16, Encoder, CMOS, CDIP16, Encoder, CMOS, CDIP16, Encoder, CMOS, CDIP16, Encoder, CMOS, PDSO16, Encoder, CMOS, PDSO16, Encoder, CMOS, PDIP16, Encoder, CMOS, CDIP16,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 SOP, SOP16,.25 SOP, SOP16,.25 DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 code R-PDIP-T16 R-XDIP-T16 R-XDIP-T16 R-XDIP-T16 R-PDSO-G16 R-PDSO-G16 R-PDIP-T16 R-XDIP-T16
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
Logic integrated circuit type ENCODER ENCODER ENCODER ENCODER ENCODER ENCODER ENCODER ENCODER
Number of terminals 16 16 16 16 16 16 16 16
Maximum operating temperature 85 °C 125 °C 125 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -55 °C -55 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC
encapsulated code DIP DIP DIP DIP SOP SOP DIP DIP
Encapsulate equivalent code DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 SOP16,.25 SOP16,.25 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE
power supply 2/6 V 5 V 2/6 V 2/6 V 2/6 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO NO NO YES YES NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL MILITARY MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1 1 - - -
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