GD74HC14J datasheet, PDF - EEWORLD Datasheet

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GD74HC14J: DescriptionInverter, CMOS, CDIP14,; Categorylogic logic; File Size230KB，5 Pages; ManufacturerLG Semicon Co., Ltd.

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GD74HC14J Overview

Inverter, CMOS, CDIP14,

GD74HC14J Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP14,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T14
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	INVERTER
MaximumI(ol)	0.004 A
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
Prop。Delay @ Nom-Sup	30 ns
Certification status	Not Qualified
Schmitt trigger	YES
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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GD74HC14J Related Products

	GD74HC14J	GD54HC14J	GD54HCT14J	GD74HCT14	GD74HC14D	GD74HC14	GD74HCT14D	GD74HCT14J
Description	Inverter, CMOS, CDIP14,	Inverter, CMOS, CDIP14,	Inverter, CMOS, CDIP14,	Inverter, CMOS, PDIP14,	Inverter, CMOS, PDSO14,	Inverter, CMOS, PDIP14,	Inverter, CMOS, PDSO14,	Inverter, CMOS, CDIP14,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	SOP, SOP14,.25	DIP, DIP14,.3	SOP, SOP14,.25	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T14	R-XDIP-T14	R-XDIP-T14	R-PDIP-T14	R-PDSO-G14	R-PDIP-T14	R-PDSO-G14	R-XDIP-T14
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	INVERTER	INVERTER	INVERTER	INVERTER	INVERTER	INVERTER	INVERTER	INVERTER
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
Number of terminals	14	14	14	14	14	14	14	14
Maximum operating temperature	85 °C	125 °C	125 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	SOP	DIP	SOP	DIP
Encapsulate equivalent code	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	SOP14,.25	DIP14,.3	SOP14,.25	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	IN-LINE
power supply	2/6 V	2/6 V	5 V	5 V	2/6 V	2/6 V	5 V	5 V
Prop。Delay @ Nom-Sup	30 ns	36 ns	38 ns	31 ns	30 ns	30 ns	31 ns	31 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	YES	YES	YES	YES	YES	YES	YES	YES
surface mount	NO	NO	NO	NO	YES	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	-	-

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