M38510/12903BPX datasheet, PDF

Datasheet> All Categories > Analog mixed-signal IC> Drivers and interfaces> M38510/12903BPX

M38510/12903BPX: DescriptionNAND Gate Based Peripheral Driver, 0.5A, CDIP8,; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size586KB，81 Pages; ManufacturerLinfinity Microelectronics

Download Datasheet Parametric Compare View All

M38510/12903BPX Overview

NAND Gate Based Peripheral Driver, 0.5A, CDIP8,

M38510/12903BPX Parametric

Parameter Name	Attribute value
package instruction	DIP,
Reach Compliance Code	unknown
Interface integrated circuit type	NAND GATE BASED PERIPHERAL DRIVER
JESD-30 code	R-GDIP-T8
length	9.6 mm
Number of functions	2
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output current flow direction	SINK
Nominal output peak current	0.5 A
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT APPLICABLE
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT APPLICABLE
Disconnect time	0.035 µs
connection time	0.035 µs
width	7.62 mm
Base Number Matches	1

Preview

Download Datasheet

View All

INCH-POUND

MIL-M-38510/129B

06 December 2004

SUPERSEDING

MIL-M-38510/129A

06 December 1985

MILITARY SPECIFICATION

MICROCIRCUITS, MONOLITHIC SILICON INTERFACE,

DUAL PERIPHERAL DRIVERS

Reactivated after 06 December 2004 and may be used for either new or existing design acquisition.

This specification is approved for use by all Departments and Agencies of the Department of Defense.

The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF-38535.

1. SCOPE

1.1 Scope. This specification covers the detail requirements for bipolar, monolithic silicon, dual peripheral drivers.

Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the

complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-

38535, (see 6.3)

1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.

1.2.1 Device types. The device types are as follows:

Device types

Circuit

Dual NAND/AND gate and transistor (separate), high speed switching

Dual AND gate and transistor (connected), high speed switching

Dual NAND gate and transistor (connected), high speed switching

Dual OR gate and transistor (connected), high speed switching

Dual NOR gate and transistor (connected), high speed switching

High voltage dual NAND/AND gate and transistor (separate), medium

speed switching

High voltage dual AND gate and transistor (connected), medium

speed switching

High voltage dual NAND gate and transistor (connected), medium

speed switching

High voltage dual OR gate and transistor (connected), medium

speed switching

High voltage dual NOR gate and transistor (connected), medium

speed switching

1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.

1.2.3 Case outline. The case outlines are as designated in MIL-STD-1835 and as follows:

Outline letter

Descriptive designator

GDIP1-T14 or CDIP2-T14

GDIP1-T8 or CDIP2-T8

Terminals

Package style

Dual in line

Comments, suggestions, or questions on this document should be addressed to: Commander, Defense

Supply Center Columbus, ATTN: DSCC-VAS, 3990 East Broad St., Columbus, OH 43218-3990, or email

Linear@dscc.dla.mil

. Since contact information can change, you may want to verify the currency of this

address information using the ASSIST Online database at

http://assist.daps.dla.mil

AMSC N/A

FSC 5962

MIL-M-38510/129B

1.3 Absolute maximum ratings.

Supply voltage ( V

) ..................................................................................... 7 V dc

Input voltage ( V

) ........................................................................................ 5.5 V dc

Interemitter voltage (V

) ............................................................................... 5.5 V dc

to substrate voltage (V

CCS

Device type 01 ............................................................................................. 35 V dc

Device type 06 ............................................................................................. 40 V dc

Collector to substrate voltage (V

Device type 01 ............................................................................................. 35 V dc

Device type 06 ............................................................................................. 40 V dc

Collector to base voltage (V

Device type 01 ............................................................................................. 35 V dc

Device type 06 ............................................................................................. 40 V dc

Collector to emitter voltage (V

CER

Device type 01 ............................................................................................. 30 V dc

Device type 06 ............................................................................................. 40 V dc

Collector to emitter voltage (V

CEO

Device type 06 ............................................................................................. 25 V dc

Emitter to base voltage (V

Device types 01 and 06 .............................................................................. 5 V dc

Offstate output voltage (V

Device types 02 through 05 ......................................................................... 30 V dc

Device types 07 through 10 ......................................................................... 35 V dc

Continuous collector current (I

Device types 01 and 06 ............................................................................... 300 mA

Continuous output current (I

Device types 02 through 05 and 07 through 10 ........................................... 300 mA 1/

Peak collector current (I

Device types 01 and 06 ............................................................................... 500 mA

Peak output current (I

Device types 02 through 05 and 07 through 10 ........................................... 500 mA

Continuous total dissipation at 25°C ambient:

Device types 01 and 06 ............................................................................... 1375 mW

Device types 02 through 05 and 07 through 10 ........................................... 1050 mW

Ambient operating temperature range ............................................................ -55°C to +125°C

Storage temperature range ............................................................................. -65°C to +150°C

Junction temperature ( T

) ............................................................................. +150°C

Lead temperature 1/16 inch from case, (soldering, 60 seconds) .................... 300°C

1.4 Recommended operating conditions.

Supply voltage range ...................................................................................... +4.5 V to +5.5 V 2/

Ambient operating temperature range ( T

) ................................................... -55°C to +125°C

_____

1/ Both halves of these dual circuits may conduct rated current simultaneously; however, power

dissipation averaged over a short time interval must fall within the continuous power dissipation ratings.

2/ For device types 01 and 06 only, the substrate (pin 8) must always be at the most negative device

voltage for proper operation.

MIL-M-38510/129B

3. REQUIREMENTS

3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a

manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before

contract award (see 4.3 and 6.4).

3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as

specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the

QM plan shall not affect the form, fit, or function as described herein.

3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as

specified in MIL-PRF-38535 and herein.

3.3.1 Logic diagrams and terminal connections. The logic diagrams and terminal connections shall be as specified

on figure 1.

3.3.2 Truth tables. The truth tables shall be as specified on figure 2.

3.3.3 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to

the qualifying activity and the preparing activity upon request.

3.3.4 Case outlines. The case outlines shall be as specified in 1.2.3.

3.3.5 Package and sealing material. Package and sealing material shall be in accordance with MIL-PRF-38535.

3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).

3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I,

and apply over the full recommended ambient operating temperature range, unless otherwise specified.

3.6 Electrical test requirements. Electrical test requirements for each device class shall be the subgroups

specified in table II. The electrical tests for each subgroup are described in table III.

3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.

3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number

53 (see MIL-PRF-38535, appendix A).

M38510/12903BPX Related Products

	M38510/12903BPX	M38510/12903BPA	M38510/12905BPX
Description	NAND Gate Based Peripheral Driver, 0.5A, CDIP8,	NAND Gate Based Peripheral Driver, 2 Driver, 0.5A, BIPolar, CDIP8, CERAMIC, DIP-8	NOR Gate Based Peripheral Driver, 0.5A, CDIP8,
package instruction	DIP,	CERAMIC, DIP-8	DIP,
Reach Compliance Code	unknown	unknown	unknown
Interface integrated circuit type	NAND GATE BASED PERIPHERAL DRIVER	NAND GATE BASED PERIPHERAL DRIVER	NOR GATE BASED PERIPHERAL DRIVER
JESD-30 code	R-GDIP-T8	R-GDIP-T8	R-GDIP-T8
length	9.6 mm	9.6 mm	9.6 mm
Number of functions	2	1	2
Number of terminals	8	8	8
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C
Output current flow direction	SINK	SINK	SINK
Nominal output peak current	0.5 A	0.5 A	0.5 A
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT APPLICABLE	NOT APPLICABLE	NOT APPLICABLE
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V
surface mount	NO	NO	NO
Temperature level	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT APPLICABLE	NOT APPLICABLE	NOT APPLICABLE
Disconnect time	0.035 µs	0.035 µs	0.035 µs
connection time	0.035 µs	0.035 µs	0.035 µs
width	7.62 mm	7.62 mm	7.62 mm
Base Number Matches	1	1	-
Maker	-	Linfinity Microelectronics	Linfinity Microelectronics

Recommended Resources

Low noise preamplifier (a)

A HI-FI active integrated speaker 01

Snowflake BY-180A refrigerator circuit

touch switch

Power supply for TTL circuit

Homemade simple remote control switch circuit

Component packaging query: Component package query. Installation dimensions with diagrams....; makey PCB Design

Get some spare development boards: 1. Brand new Microchip original PIC24F K-Series Microstick kit 80RMB Free shipping The Microstick tool for the 3V PIC24F K series provides an economical and easy-to-use development environment for the...; mikeliujia Buy&Sell

Network Development Notes 3_Multi-Web Development: A web development platformThere are many development platforms for web development. For simple ones, any tool that can write text will do, such as Notepad. For more professional ones, there are Dreamw...; yuhua8688 Microcontroller MCU

Complete the six elements of wireless LAN construction: Wireless networks are becoming the focus of people's pursuit with their "omnipresent" charm. Whether it is network upgrade or re-networking, people always hope that their networks can get rid of the c...; yxh99 RF/Wirelessly

Magical disassembly tool - Rice brush: I didn't intend to disassemble it so quickly, but @[color=rgb(35, 102, 168)][url=https://bbs.eeworld.com.cn/home.php?mod=space&uid=303079]littleshrimp[/url][/color] urged me to do it, so I took a few ...; dcexpert Making friends through disassembly

Development board serial port problem, help!: 0000000 irq:0 2: uart:unknown port:00000000 irq:0 3: uart:unknown port:00000000 irq:0 There are three device files s3c2410_serial0 1 2 under /dev. s3c2410_serial0 1 2 are connected, and the connected ...; hhhhh88 Embedded System

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components