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82S131A/BFA

Description
OTP ROM, 512X4, 35ns, TTL, CDFP16,
Categorystorage    storage   
File Size50KB,3 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

82S131A/BFA Overview

OTP ROM, 512X4, 35ns, TTL, CDFP16,

82S131A/BFA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDFP, FL16,.3
Reach Compliance Codeunknown
Maximum access time35 ns
JESD-30 codeR-XDFP-F16
JESD-609 codee0
memory density2048 bit
Memory IC TypeOTP ROM
memory width4
Number of terminals16
word count512 words
character code512
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512X4
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL16,.3
Package shapeRECTANGULAR
Package formFLATPACK
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Base Number Matches1
Philips Semiconductors Military Bipolar Memory Products
Product specification
2K-bit TTL bipolar PROM (512x4)
82S130A
82S131A
FEATURES
Address access time: 35ns max
Input loading: -150µA max
On-chip address decoding
One chip enable input
Output options:
82S130A: Open collector
82S131A: 3-State
DESCRIPTION
The 82S130A and 82S131A are field-programmable, which means
that custom patterns are immediately available by following the
Philips Generic I fusing procedure. The standard 82S130A and
82S131A are supplied with all outputs at a logical Low. Outputs are
programmed to a logic High level at any specified address by fusing
the Ni-Cr link matrix.
These devices include on-chip decoding and 1 chip enable input for
ease of memory expansion. They feature either Open collector or
3-State outputs for optimization of word expansion in bused
organizations.
No separate fusing pins
Unprogrammed outputs are Low level
Fully TTL compatible
APPLICATIONS
ORDERING INFORMATION
DESCRIPTION
16-pin Ceramic DIP
(300mil-wide)
16-pin Ceramic Flat Pack
ORDER CODE
82S130A/BEA,
82S131A/BEA
82S130A/BFA,
82S131A/BFA
PACKAGE
DESIGNATOR*
GDIP1-T16
GDIP1-T16
GDFP2-F16
GDFP2-F16
Prototyping/volume production
Sequential controllers
Microprogramming
Hardwired algorithms
Control store
Random logic
Code conversion
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
CC
V
I
V
O
V
O
T
A
T
STG
Supply voltage
Input voltage
Output voltage High (82S130A)
Output voltage Off-State (82S131A)
Operating temperature range
Storage temperature range
PARAMETER
* MIL-STD 1835 or Appendix A of 1995 Military Data Handbook
RATING
+7
+5.5
+5.5
+5.5
-55 to +125
-65 to +150
UNIT
V
DC
V
DC
V
DC
V
DC
°
C
°
C
PIN CONFIGURATION
BLOCK DIAGRAM
A
4
ADDRESS
LINES
1:32
DECODER
32 x 64
A
6
A
5
A
4
A
3
A
0
A
1
A
2
GND
1
2
3
4
5
6
7
8
16 V
CC
15 A
7
14 A
8
13 CE
12 O
1
11 O
2
10 O
3
9
O
4
A
8
A
0
A
1
A
2
A
3
1:16
MUX
1:16
MUX
1:16
MUX
1:16
MUX
CE
4 OUTPUT DRIVERS
O
1
O
2
O
3
O
4
OUTPUT LINES
November 10, 1987
1
853-0257 F00356

82S131A/BFA Related Products

82S131A/BFA 82S130A/BFA 82S130A/BEA 82S131A/BEA
Description OTP ROM, 512X4, 35ns, TTL, CDFP16, OTP ROM, 512X4, 35ns, TTL, CDFP16, OTP ROM, 512X4, 35ns, TTL, CDIP16, OTP ROM, 512X4, 35ns, TTL, CDIP16,
Is it Rohs certified? incompatible incompatible incompatible incompatible
package instruction DFP, FL16,.3 DFP, FL16,.3 DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown unknown
Maximum access time 35 ns 35 ns 35 ns 35 ns
JESD-30 code R-XDFP-F16 R-XDFP-F16 R-XDIP-T16 R-XDIP-T16
JESD-609 code e0 e0 e0 e0
memory density 2048 bit 2048 bit 2048 bit 2048 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM
memory width 4 4 4 4
Number of terminals 16 16 16 16
word count 512 words 512 words 512 words 512 words
character code 512 512 512 512
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C
organize 512X4 512X4 512X4 512X4
Package body material CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DFP DFP DIP DIP
Encapsulate equivalent code FL16,.3 FL16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK FLATPACK IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES YES NO NO
technology TTL TTL TTL TTL
Temperature level MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT FLAT THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 -
Maker - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)

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