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MC145453PS

Description
Interface Circuit, CMOS, PDIP40
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size257KB,6 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MC145453PS Overview

Interface Circuit, CMOS, PDIP40

MC145453PS Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP40,.6
Reach Compliance Codeunknown
display modeSEGMENT
JESD-30 codeR-PDIP-T40
JESD-609 codee0
Number of base plates1-BP
Number of segments33
Number of terminals40
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply3/10 V
Certification statusNot Qualified
Maximum slew rate0.04 mA
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

MC145453PS Related Products

MC145453PS MC145453PD MC145453FNDS MC145453FNS MC145453FND
Description Interface Circuit, CMOS, PDIP40 Interface Circuit, CMOS, PDIP40 Interface Circuit, CMOS, PQCC44 Interface Circuit, CMOS, PQCC44 Interface Circuit, CMOS, PQCC44
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP40,.6 DIP, DIP40,.6 QCCJ, LDCC44,.7SQ QCCJ, LDCC44,.7SQ QCCJ, LDCC44,.7SQ
Reach Compliance Code unknown unknown unknown unknown unknown
display mode SEGMENT SEGMENT SEGMENT SEGMENT SEGMENT
JESD-30 code R-PDIP-T40 R-PDIP-T40 S-PQCC-J44 S-PQCC-J44 S-PQCC-J44
JESD-609 code e0 e0 e0 e0 e0
Number of base plates 1-BP 1-BP 1-BP 1-BP 1-BP
Number of segments 33 33 33 33 33
Number of terminals 40 40 44 44 44
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP QCCJ QCCJ QCCJ
Encapsulate equivalent code DIP40,.6 DIP40,.6 LDCC44,.7SQ LDCC44,.7SQ LDCC44,.7SQ
Package shape RECTANGULAR RECTANGULAR SQUARE SQUARE SQUARE
Package form IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER CHIP CARRIER
power supply 3/10 V 3/10 V 3/10 V 3/10 V 3/10 V
Maximum slew rate 0.04 mA 0.04 mA 0.04 mA 0.04 mA 0.04 mA
surface mount NO NO YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE J BEND J BEND J BEND
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL QUAD QUAD QUAD
Base Number Matches 1 1 1 1 1
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