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S87L51FA-8A44

Description
Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, PQCC44,
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,15 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

S87L51FA-8A44 Overview

Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, PQCC44,

S87L51FA-8A44 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionQCCJ, LDCC44,.7SQ
Reach Compliance Codeunknown
bit size8
CPU series8051
JESD-30 codeS-PQCC-J44
JESD-609 codee0
Number of terminals44
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC44,.7SQ
Package shapeSQUARE
Package formCHIP CARRIER
power supply3/4.5 V
Certification statusNot Qualified
RAM (bytes)256
rom(word)8192
ROM programmabilityUVPROM
speed20 MHz
Maximum slew rate22 mA
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Base Number Matches1
This Material Copyrighted By Its Respective Manufacturer

S87L51FA-8A44 Related Products

S87L51FA-8A44 S87L51FA-5N40 S83L51FA-5A44 S87L51FA-8K44
Description Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, PQCC44, Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PDIP40, Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQCC44, Microcontroller, 8-Bit, UVPROM, 8051 CPU, 20MHz, CMOS, CQCC44,
Is it Rohs certified? incompatible incompatible incompatible incompatible
package instruction QCCJ, LDCC44,.7SQ DIP, DIP40,.6 QCCJ, LDCC44,.7SQ QCCJ, LDCC44,.7SQ
Reach Compliance Code unknown unknown unknown unknown
bit size 8 8 8 8
CPU series 8051 8051 8051 8051
JESD-30 code S-PQCC-J44 R-PDIP-T40 S-PQCC-J44 S-XQCC-J44
JESD-609 code e0 e0 e0 e0
Number of terminals 44 40 44 44
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC
encapsulated code QCCJ DIP QCCJ QCCJ
Encapsulate equivalent code LDCC44,.7SQ DIP40,.6 LDCC44,.7SQ LDCC44,.7SQ
Package shape SQUARE RECTANGULAR SQUARE SQUARE
Package form CHIP CARRIER IN-LINE CHIP CARRIER CHIP CARRIER
power supply 3/4.5 V 3/4.5 V 3/4.5 V 3/4.5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 256 256 256 256
rom(word) 8192 8192 8192 8192
ROM programmability UVPROM UVPROM MROM UVPROM
speed 20 MHz 16 MHz 16 MHz 20 MHz
Maximum slew rate 22 mA 19 mA 19 mA 22 mA
surface mount YES NO YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND THROUGH-HOLE J BEND J BEND
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 1.27 mm
Terminal location QUAD DUAL QUAD QUAD
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