64KX18 DUAL-PORT SRAM, 6ns, PQFP100, TQFP-100
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | QFP |
| package instruction | LQFP, |
| Contacts | 100 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 6 ns |
| JESD-30 code | R-PQFP-G100 |
| JESD-609 code | e0 |
| length | 20 mm |
| memory density | 1179648 bit |
| Memory IC Type | DUAL-PORT SRAM |
| memory width | 18 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 100 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64KX18 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LQFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 1.6 mm |
| Maximum supply voltage (Vsup) | 3.465 V |
| Minimum supply voltage (Vsup) | 3.135 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 14 mm |
| Base Number Matches | 1 |
| MCM69D618TQ6 | MCM69D618TQ8 | MCM69D618TQ8R | |
|---|---|---|---|
| Description | 64KX18 DUAL-PORT SRAM, 6ns, PQFP100, TQFP-100 | 64KX18 DUAL-PORT SRAM, PQFP100, TQFP-100 | 64KX18 DUAL-PORT SRAM, PQFP100, TQFP-100 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Parts packaging code | QFP | QFP | QFP |
| package instruction | LQFP, | LQFP, | LQFP, |
| Contacts | 100 | 100 | 100 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| JESD-30 code | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
| JESD-609 code | e0 | e0 | e0 |
| length | 20 mm | 20 mm | 20 mm |
| memory density | 1179648 bit | 1179648 bit | 1179648 bit |
| Memory IC Type | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
| memory width | 18 | 18 | 18 |
| Number of functions | 1 | 1 | 1 |
| Number of ports | 2 | 2 | 2 |
| Number of terminals | 100 | 100 | 100 |
| word count | 65536 words | 65536 words | 65536 words |
| character code | 64000 | 64000 | 64000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| organize | 64KX18 | 64KX18 | 64KX18 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LQFP | LQFP | LQFP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.6 mm | 1.6 mm | 1.6 mm |
| Maximum supply voltage (Vsup) | 3.465 V | 3.465 V | 3.465 V |
| Minimum supply voltage (Vsup) | 3.135 V | 3.135 V | 3.135 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm |
| Terminal location | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 14 mm | 14 mm | 14 mm |
| Base Number Matches | 1 | 1 | 1 |
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