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MMFT960T3

Description
300mA, 60V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-261AA
CategoryDiscrete semiconductor    The transistor   
File Size122KB,6 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MMFT960T3 Overview

300mA, 60V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-261AA

MMFT960T3 Parametric

Parameter NameAttribute value
package instructionSMALL OUTLINE, R-PDSO-G4
Reach Compliance Codeunknown
ECCN codeEAR99
Shell connectionDRAIN
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage60 V
Maximum drain current (ID)0.3 A
Maximum drain-source on-resistance1.7 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeTO-261AA
JESD-30 codeR-PDSO-G4
Number of components1
Number of terminals4
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Polarity/channel typeN-CHANNEL
Maximum power consumption environment0.8 W
Certification statusNot Qualified
surface mountYES
Terminal formGULL WING
Terminal locationDUAL
transistor applicationsSWITCHING
Transistor component materialsSILICON
Base Number Matches1
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MMFT960T1/D
Medium Power Field Effect
Transistor
N–Channel Enhancement–Mode
Silicon Gate TMOS
SOT–223 for Surface Mount
This TMOS medium power field effect transistor is designed for
high speed, low loss power switching applications such as
switching regulators, dc–dc converters, solenoid and relay drivers.
The device is housed in the SOT–223 package which is designed
for medium power surface mount applications.
Silicon Gate for Fast Switching Speeds
RDS(on) = 1.7 Ohm Max
Low Drive Requirement
The SOT–223 Package can be soldered using wave or reflow.
The formed leads absorb thermal stress during soldering
eliminating the possibility of damage to the die.
Available in 12 mm Tape and Reel
Use MMFT960T1 to order the 7 inch/1000 unit reel
Use MMFT960T3 to order the 13 inch/4000 unit reel
1
GATE
3 SOURCE
2,4 DRAIN
MMFT960T1
Motorola Preferred Device
MEDIUM POWER
TMOS FET
300 mA
60 VOLTS
RDS(on) = 1.7 OHM MAX
®
4
1
2
3
CASE 318E–04, STYLE 3
TO–261AA
MAXIMUM RATINGS
(TC = 25°C unless otherwise noted)
Rating
Drain–to–Source Voltage
Gate–to–Source Voltage — Non–Repetitive
Drain Current
Total Power Dissipation @ TA = 25°C(1)
Derate above 25°C
Operating and Storage Temperature Range
Symbol
VDS
VGS
ID
PD
TJ, Tstg
Value
60
±
30
300
0.8
6.4
– 65 to 150
Unit
Volts
Volts
mAdc
Watts
mW/°C
°C
DEVICE MARKING
FT960
THERMAL CHARACTERISTICS
Thermal Resistance — Junction–to–Ambient
Maximum Temperature for Soldering Purposes
Time in Solder Bath
R
θJA
TL
156
260
10
°C/W
°C
Sec
1. Device mounted on a FR–4 glass epoxy printed circuit board using minimum recommended footprint.
TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company
Preferred
devices are Motorola recommended choices for future use and best overall value.
REV 3
Motorola Small–Signal Transistors, FETs and Diodes Device Data
©
Motorola, Inc. 1997
1
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