Bus Driver, 1-Func, 4-Bit, True Output, CMOS, CDIP14,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| Control type | ENABLE HIGH |
| JESD-30 code | R-XDIP-T14 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | BUS DRIVER |
| MaximumI(ol) | 0.006 A |
| Number of digits | 4 |
| Number of functions | 1 |
| Number of terminals | 14 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Prop。Delay @ Nom-Sup | 35 ns |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| GD74HCT126J | GD74HCT126 | GD74HCT126D | GD54HC126J | GD54HCT126J | GD74HC126D | GD74HC126 | GD74HC126J | |
|---|---|---|---|---|---|---|---|---|
| Description | Bus Driver, 1-Func, 4-Bit, True Output, CMOS, CDIP14, | Bus Driver, 1-Func, 4-Bit, True Output, CMOS, PDIP14, | Bus Driver, 1-Func, 4-Bit, True Output, CMOS, PDSO14, | Bus Driver, 1-Func, 4-Bit, True Output, CMOS, CDIP14, | Bus Driver, 1-Func, 4-Bit, True Output, CMOS, CDIP14, | Bus Driver, 1-Func, 4-Bit, True Output, CMOS, PDSO14, | Bus Driver, 1-Func, 4-Bit, True Output, CMOS, PDIP14, | Bus Driver, 1-Func, 4-Bit, True Output, CMOS, CDIP14, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknown |
| Control type | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH |
| JESD-30 code | R-XDIP-T14 | R-PDIP-T14 | R-PDSO-G14 | R-XDIP-T14 | R-XDIP-T14 | R-PDSO-G14 | R-PDIP-T14 | R-XDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| MaximumI(ol) | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
| Number of digits | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | DIP | SOP | DIP | DIP | SOP | DIP | DIP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | SOP14,.25 | DIP14,.3 | DIP14,.3 | SOP14,.25 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 2/6 V | 5 V | 2/6 V | 2/6 V | 2/6 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | YES | NO | NO | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | SOP, SOP14,.25 | DIP, DIP14,.3 | DIP, DIP14,.3 | - | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Prop。Delay @ Nom-Sup | 35 ns | 35 ns | 35 ns | 38 ns | 40 ns | 30 ns | - | 30 ns |
| Maker | - | - | - | LG Semicon Co., Ltd. | LG Semicon Co., Ltd. | LG Semicon Co., Ltd. | LG Semicon Co., Ltd. | LG Semicon Co., Ltd. |