UPD78F1144GA-HAB-AX datasheet, PDF

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UPD78F1144GA-HAB-AX: DescriptionMicrocontroller, 16-Bit, FLASH, 20MHz, CMOS, PQFP64, 7 X 7 MM, 0.40 MM PITCH, PLASTIC, TQFP-64; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，726 Pages; ManufacturerNEC Electronics; Environmental Compliance

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UPD78F1144GA-HAB-AX Overview

Microcontroller, 16-Bit, FLASH, 20MHz, CMOS, PQFP64, 7 X 7 MM, 0.40 MM PITCH, PLASTIC, TQFP-64

UPD78F1144GA-HAB-AX Parametric

Parameter Name	Attribute value
package instruction	7 X 7 MM, 0.40 MM PITCH, PLASTIC, TQFP-64
Reach Compliance Code	unknown
Has ADC	YES
Other features	ALSO OPERATES AT 1.8V SUPPLY AT 5 MHZ
Address bus width
bit size	16
maximum clock frequency	20 MHz
DAC channel	NO
DMA channel	YES
External data bus width
JESD-30 code	S-PQFP-G64
length	7 mm
Number of I/O lines	55
Number of terminals	64
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	TFQFP
Package shape	SQUARE
Package form	FLATPACK, THIN PROFILE, FINE PITCH
Certification status	Not Qualified
ROM programmability	FLASH
Maximum seat height	1.2 mm
speed	20 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	2.7 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.4 mm
Terminal location	QUAD
width	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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User’s Manual

78K0R/KE3

16-bit Single-Chip Microcontrollers

PD78F1142

PD78F1143

PD78F1144

PD78F1145

PD78F1146

The 78K0R/KE3 has an on-chip debug function.

Do not use this product for mass production because its reliability cannot be guaranteed after the on-chip debug function

has been used, due to issues with respect to the number of times the flash memory can be rewritten. NEC Electronics

does not accept complaints concerning this product after the on-chip debug function has been used.

Document No. U17854EJ6V0UD00 (6th edition)

Date Published August 2007 NS

2006

Printed in Japan

NOTES FOR CMOS DEVICES

VOLTAGE APPLICATION WAVEFORM AT INPUT PIN

Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the

CMOS device stays in the area between V

(MAX) and V

(MIN) due to noise, etc., the device may

malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed,

and also in the transition period when the input level passes through the area between V

(MAX) and

(MIN).

HANDLING OF UNUSED INPUT PINS

Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is

possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS

devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed

high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to V

or GND

via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must

be judged separately for each device and according to related specifications governing the device.

PRECAUTION AGAINST ESD

A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and

ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as

much as possible, and quickly dissipate it when it has occurred.

Environmental control must be

adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that

easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static

container, static shielding bag or conductive material. All test and measurement tools including work

benches and floors should be grounded.

The operator should be grounded using a wrist strap.

Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for

PW boards with mounted semiconductor devices.

STATUS BEFORE INITIALIZATION

Power-on does not necessarily define the initial status of a MOS device. Immediately after the power

source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does

not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the

reset signal is received. A reset operation must be executed immediately after power-on for devices

with reset functions.

POWER ON/OFF SEQUENCE

In the case of a device that uses different power supplies for the internal operation and external

interface, as a rule, switch on the external power supply after switching on the internal power supply.

When switching the power supply off, as a rule, switch off the external power supply and then the

internal power supply. Use of the reverse power on/off sequences may result in the application of an

overvoltage to the internal elements of the device, causing malfunction and degradation of internal

elements due to the passage of an abnormal current.

The correct power on/off sequence must be judged separately for each device and according to related

specifications governing the device.

INPUT OF SIGNAL DURING POWER OFF STATE

Do not input signals or an I/O pull-up power supply while the device is not powered. The current

injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and

the abnormal current that passes in the device at this time may cause degradation of internal elements.

Input of signals during the power off state must be judged separately for each device and according to

related specifications governing the device.

User’s Manual U17854EJ6V0UD

Windows and Windows NT are registered trademarks or trademarks of Microsoft Corporation in the United

States and/or other countries.

PC/AT is a trademark of International Business Machines Corporation.

EEPROM is a trademark of NEC Electronics Corporation.

SuperFlash is a registered trademark of Silicon Storage Technology, Inc. in several countries including the

United States and Japan.

Caution: This product uses SuperFlash

technology licensed from Silicon Storage Technology, Inc.

•

The information in this document is current as of August, 2007. The information is subject to

change without notice. For actual design-in, refer to the latest publications of NEC Electronics data

sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not

all products and/or types are available in every country. Please check with an NEC Electronics sales

representative for availability and additional information.

•

No part of this document may be copied or reproduced in any form or by any means without the prior

written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may

appear in this document.

•

NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual

property rights of third parties by or arising from the use of NEC Electronics products listed in this document

or any other liability arising from the use of such products. No license, express, implied or otherwise, is

granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.

•

Descriptions of circuits, software and other related information in this document are provided for illustrative

purposes in semiconductor product operation and application examples. The incorporation of these

circuits, software and information in the design of a customer's equipment shall be done under the full

responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by

customers or third parties arising from the use of these circuits, software and information.

•

While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,

customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To

minimize risks of damage to property or injury (including death) to persons arising from defects in NEC

Electronics products, customers must incorporate sufficient safety measures in their design, such as

redundancy, fire-containment and anti-failure features.

•

NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and

"Specific".

The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-

designated "quality assurance program" for a specific application. The recommended applications of an NEC

Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of

each NEC Electronics product before using it in a particular application.

"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio

and visual equipment, home electronic appliances, machine tools, personal electronic equipment

and industrial robots.

"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support).

"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems and medical equipment for life support, etc.

The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC

Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications

not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to

determine NEC Electronics' willingness to support a given application.

(Note)

(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its

majority-owned subsidiaries.

(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as

defined above).

M8E 02. 11-1

User’s Manual U17854EJ6V0UD

UPD78F1144GA-HAB-AX Related Products

	UPD78F1144GA-HAB-AX	UPD78F1145GA-HAB-AX	UPD78F1146GA-HAB-AX	UPD78F1145F1-AN1-A	UPD78F1143F1-AN1-A	UPD78F1143GA-HAB-AX	UPD78F1144F1-AN1-A
Description	Microcontroller, 16-Bit, FLASH, 20MHz, CMOS, PQFP64, 7 X 7 MM, 0.40 MM PITCH, PLASTIC, TQFP-64	Microcontroller, 16-Bit, FLASH, 20MHz, CMOS, PQFP64, 7 X 7 MM, 0.40 MM PITCH, PLASTIC, TQFP-64	Microcontroller, 16-Bit, FLASH, 20MHz, CMOS, PQFP64, 7 X 7 MM, 0.40 MM PITCH, PLASTIC, TQFP-64	Microcontroller, 16-Bit, FLASH, 20MHz, CMOS, PBGA64, 5 X 5 MM, 0.50 MM PITCH, PLASTIC, FBGA-64	Microcontroller, 16-Bit, FLASH, 20MHz, CMOS, PBGA64, 5 X 5 MM, 0.50 MM PITCH, PLASTIC, FBGA-64	Microcontroller, 16-Bit, FLASH, 20MHz, CMOS, PQFP64, 7 X 7 MM, 0.40 MM PITCH, PLASTIC, TQFP-64	Microcontroller, 16-Bit, FLASH, 20MHz, CMOS, PBGA64, 5 X 5 MM, 0.50 MM PITCH, PLASTIC, FBGA-64
package instruction	7 X 7 MM, 0.40 MM PITCH, PLASTIC, TQFP-64	TFQFP,	7 X 7 MM, 0.40 MM PITCH, PLASTIC, TQFP-64	5 X 5 MM, 0.50 MM PITCH, PLASTIC, FBGA-64	5 X 5 MM, 0.50 MM PITCH, PLASTIC, FBGA-64	7 X 7 MM, 0.40 MM PITCH, PLASTIC, TQFP-64	5 X 5 MM, 0.50 MM PITCH, PLASTIC, FBGA-64
Reach Compliance Code	unknown	compliant	unknown	unknown	unknown	unknown	unknown
Has ADC	YES	YES	YES	YES	YES	YES	YES
Other features	ALSO OPERATES AT 1.8V SUPPLY AT 5 MHZ	ALSO OPERATES AT 1.8V SUPPLY AT 5 MHZ	ALSO OPERATES AT 1.8V SUPPLY AT 5 MHZ	ALSO OPERATES AT 1.8V SUPPLY AT 5 MHZ	ALSO OPERATES AT 1.8V SUPPLY AT 5 MHZ	ALSO OPERATES AT 1.8V SUPPLY AT 5 MHZ	ALSO OPERATES AT 1.8V SUPPLY AT 5 MHZ
bit size	16	16	16	16	16	16	16
maximum clock frequency	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO
DMA channel	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PBGA-B64	S-PBGA-B64	S-PQFP-G64	S-PBGA-B64
length	7 mm	7 mm	7 mm	5 mm	5 mm	7 mm	5 mm
Number of I/O lines	55	55	55	55	55	55	55
Number of terminals	64	64	64	64	64	64	64
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFQFP	TFQFP	TFQFP	VFBGA	VFBGA	TFQFP	VFBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1 mm	1 mm	1.2 mm	1 mm
speed	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	BALL	BALL	GULL WING	BALL
Terminal pitch	0.4 mm	0.4 mm	0.4 mm	0.5 mm	0.5 mm	0.4 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	BOTTOM	BOTTOM	QUAD	BOTTOM
width	7 mm	7 mm	7 mm	5 mm	5 mm	7 mm	5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Maker	-	NEC Electronics	NEC Electronics	NEC Electronics	NEC Electronics	NEC Electronics	NEC Electronics

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