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MPC8250ACZQIHBB

Description
32-BIT, 200MHz, RISC PROCESSOR, PBGA516, 27 X 27 MM, 1.25 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-516
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size886KB,73 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MPC8250ACZQIHBB Overview

32-BIT, 200MHz, RISC PROCESSOR, PBGA516, 27 X 27 MM, 1.25 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-516

MPC8250ACZQIHBB Parametric

Parameter NameAttribute value
Parts packaging codeBGA
package instructionBGA,
Contacts516
Reach Compliance Codeunknown
Other featuresREQUIRES 3.3V SUPPLY FOR I/O
Address bus width32
bit size32
boundary scanYES
External data bus width64
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B516
length27 mm
low power modeNO
Number of terminals516
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
Maximum seat height2.55 mm
speed200 MHz
Maximum supply voltage1.9 V
Minimum supply voltage1.7 V
Nominal supply voltage1.8 V
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width27 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Base Number Matches1
Technical Data
MPC8250EC/D
Rev. 0.9 8/2003
MPC8250
Hardware Specifications
This document contains detailed information on power considerations, DC/AC electrical
characteristics, and AC timing specifications for the MPC8250 PowerQUICC II™
communications processor.
The following topics are addressed:
Topic
Section 1.1, “Features”
Section 1.2, “Electrical and Thermal Characteristics”
Section 1.2.1, “DC Electrical Characteristics”
Section 1.2.2, “Thermal Characteristics”
Section 1.2.3, “Power Considerations”
Section 1.2.4, “AC Electrical Characteristics”
Section 1.3, “Clock Configuration Modes”
Section 1.3.1, “Local Bus Mode”
Section 1.3.2, “PCI Mode”
Section 1.4, “Pinout”
Section 1.5, “Package Description”
Section 1.6, “Ordering Information”
Page
2
5
5
10
10
11
19
19
22
28
53
56
The MPC8250 is available in two packages—the standard ZU package (480 TBGA) and an
alternate VR package (516 PBGA)—as described in Section 1.4, “Pinout,” and Section 1.5,
“Package Description.” For more information on VR packages, contact your Motorola sales
office. Note that throughout this document references to the MPC8250 are inclusive of its VR
version unless otherwise specified.
NOTE: Document Revision History
Changes to this document are summarized in Table 23 on
page 56.
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