UPD789022GB-XXX-8ES datasheet, PDF - EEWORLD Datasheet

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UPD789022GB-XXX-8ES: DescriptionMicrocontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP44, 10 X 10 MM, PLASTIC, LQFP-44; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，221 Pages; ManufacturerNEC Electronics

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UPD789022GB-XXX-8ES Overview

Microcontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP44, 10 X 10 MM, PLASTIC, LQFP-44

UPD789022GB-XXX-8ES Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	10 X 10 MM, PLASTIC, LQFP-44
Reach Compliance Code	compliant
Has ADC	NO
Address bus width
bit size	8
maximum clock frequency	5 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-PQFP-G44
JESD-609 code	e0
length	10 mm
Number of I/O lines	34
Number of terminals	44
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
ROM programmability	MROM
Maximum seat height	1.6 mm
speed	5 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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User’s Manual

µ

PD789026 Subseries

8-Bit Single-Chip Microcontrollers

µ

PD789022

µ

PD789024

µ

PD789025

µ

PD789026

µ

PD78F9026A

Document No. U11919EJ4V0UD00 (4th edition)

Date Published February 2003 N CP(K)

©

Printed in Japan

NOTES FOR CMOS DEVICES

1

PRECAUTION AGAINST ESD FOR SEMICONDUCTORS

Note:

Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and

ultimately degrade the device operation. Steps must be taken to stop generation of static electricity

as much as possible, and quickly dissipate it once, when it has occurred. Environmental control

must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using

insulators that easily build static electricity. Semiconductor devices must be stored and transported

in an anti-static container, static shielding bag or conductive material. All test and measurement

tools including work bench and floor should be grounded. The operator should be grounded using

wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need

to be taken for PW boards with semiconductor devices on it.

2

HANDLING OF UNUSED INPUT PINS FOR CMOS

Note:

No connection for CMOS device inputs can be cause of malfunction. If no connection is provided

to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence

causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels

of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused

pin should be connected to V

DD

or GND with a resistor, if it is considered to have a possibility of

being an output pin. All handling related to the unused pins must be judged device by device and

related specifications governing the devices.

3

STATUS BEFORE INITIALIZATION OF MOS DEVICES

Note:

Power-on does not necessarily define initial status of MOS device. Production process of MOS

does not define the initial operation status of the device. Immediately after the power source is

turned ON, the devices with reset function have not yet been initialized. Hence, power-on does

not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the

reset signal is received. Reset operation must be executed immediately after power-on for devices

having reset function.

EEPROM and FIP are trademarks of NEC Electronics Corporation.

Windows and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in the

United States and/or other countries.

PC/AT is a trademark of International Business Machines Corporation.

HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company.

SPARCstation is a trademark of SPARC International, Inc.

Solaris and SunOS are trademarks of Sun Microsystems, Inc.

User’s Manual U11919EJ4V0UD

3

These commodities, technology or software, must be exported in accordance

with the export administration regulations of the exporting country.

Diversion contrary to the law of that country is prohibited.

•

The information in this document is current as of September, 2002. The information is subject to

change without notice. For actual design-in, refer to the latest publications of NEC Electronics data

sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not

all products and/or types are available in every country. Please check with an NEC Electronics sales

representative for availability and additional information.

•

No part of this document may be copied or reproduced in any form or by any means without the prior

written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may

appear in this document.

•

NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual

property rights of third parties by or arising from the use of NEC Electronics products listed in this document

or any other liability arising from the use of such products. No license, express, implied or otherwise, is

granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.

•

Descriptions of circuits, software and other related information in this document are provided for illustrative

purposes in semiconductor product operation and application examples. The incorporation of these

circuits, software and information in the design of a customer's equipment shall be done under the full

responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by

customers or third parties arising from the use of these circuits, software and information.

•

While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,

customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To

minimize risks of damage to property or injury (including death) to persons arising from defects in NEC

Electronics products, customers must incorporate sufficient safety measures in their design, such as

redundancy, fire-containment and anti-failure features.

•

NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and

"Specific".

The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-

designated "quality assurance program" for a specific application. The recommended applications of an NEC

Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of

each NEC Electronics product before using it in a particular application.

"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio

and visual equipment, home electronic appliances, machine tools, personal electronic equipment

and industrial robots.

"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support).

"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems and medical equipment for life support, etc.

The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC

Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications

not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to

determine NEC Electronics' willingness to support a given application.

(Note)

(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its

majority-owned subsidiaries.

(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as

defined above).

M8E 02. 11-1

4

User’s Manual U11919EJ4V0UD

UPD789022GB-XXX-8ES Related Products

	UPD789022GB-XXX-8ES	UPD789026GB-XXX-8ES-A	UPD789026GB-XXX-8ES	UPD789022GB-XXX-8ES-A	UPD789025GB-XXX-8ES-A	UPD789024GB-XXX-8ES	UPD78F9026AGB-8ES	UPD789024GB-XXX-8ES-A	UPD789025GB-XXX-8ES
Description	Microcontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP44, 10 X 10 MM, PLASTIC, LQFP-44	Microcontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP44, 10 X 10 MM, PLASTIC, LQFP-44	Microcontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP44, 10 X 10 MM, PLASTIC, LQFP-44	Microcontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP44, 10 X 10 MM, PLASTIC, LQFP-44	Microcontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP44, 10 X 10 MM, PLASTIC, LQFP-44	Microcontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP44, 10 X 10 MM, PLASTIC, LQFP-44	Microcontroller, 8-Bit, FLASH, 5MHz, CMOS, PQFP44, 10 X 10 MM, PLASTIC, LQFP-44	Microcontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP44, 10 X 10 MM, PLASTIC, LQFP-44	Microcontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP44, 10 X 10 MM, PLASTIC, LQFP-44
Is it Rohs certified?	incompatible	conform to	incompatible	conform to	conform to	incompatible	incompatible	conform to	incompatible
package instruction	10 X 10 MM, PLASTIC, LQFP-44	10 X 10 MM, PLASTIC, LQFP-44	10 X 10 MM, PLASTIC, LQFP-44	10 X 10 MM, PLASTIC, LQFP-44	10 X 10 MM, PLASTIC, LQFP-44	10 X 10 MM, PLASTIC, LQFP-44	10 X 10 MM, PLASTIC, LQFP-44	10 X 10 MM, PLASTIC, LQFP-44	10 X 10 MM, PLASTIC, LQFP-44
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
Has ADC	NO	NO	NO	NO	NO	NO	NO	NO	NO
bit size	8	8	8	8	8	8	8	8	8
maximum clock frequency	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO	NO	NO	NO	NO
JESD-30 code	S-PQFP-G44	S-PQFP-G44	S-PQFP-G44	S-PQFP-G44	S-PQFP-G44	S-PQFP-G44	S-PQFP-G44	S-PQFP-G44	S-PQFP-G44
JESD-609 code	e0	e6/e4	e0	e6/e4	e6/e4	e0	e0	e6/e4	e0
length	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm
Number of I/O lines	34	34	34	34	34	34	34	34	34
Number of terminals	44	44	44	44	44	44	44	44	44
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	NO	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260	NOT SPECIFIED	260	260	NOT SPECIFIED	NOT SPECIFIED	260	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM programmability	MROM	MROM	MROM	MROM	MROM	MROM	FLASH	MROM	MROM
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
speed	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	TIN BISMUTH/NICKEL PALLADIUM GOLD	TIN LEAD	TIN BISMUTH/NICKEL PALLADIUM GOLD	TIN BISMUTH/NICKEL PALLADIUM GOLD	TIN LEAD	TIN LEAD	TIN BISMUTH/NICKEL PALLADIUM GOLD	TIN LEAD
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	10	NOT SPECIFIED	10	10	NOT SPECIFIED	NOT SPECIFIED	10	NOT SPECIFIED
width	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Base Number Matches	1	1	1	1	1	1	-	-	-

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