BC477XDCSM datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> The transistor> BC477XDCSM

BC477XDCSM: DescriptionSmall Signal Bipolar Transistor, 0.1A I(C), 80V V(BR)CEO, 2-Element, PNP, Silicon, MO-041BB, HERMETIC SEALED, CERAMIC, LCC2-6; CategoryDiscrete semiconductor The transistor; File Size11KB，1 Pages; ManufacturerTT Electronics plc; Websitehttp://www.ttelectronics.com/

Download Datasheet Parametric View All

BC477XDCSM Overview

Small Signal Bipolar Transistor, 0.1A I(C), 80V V(BR)CEO, 2-Element, PNP, Silicon, MO-041BB, HERMETIC SEALED, CERAMIC, LCC2-6

BC477XDCSM Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	TT Electronics plc
package instruction	SMALL OUTLINE, R-CDSO-N6
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum collector current (IC)	0.1 A
Collector-emitter maximum voltage	80 V
Configuration	SEPARATE, 2 ELEMENTS
Minimum DC current gain (hFE)	50
JEDEC-95 code	MO-041BB
JESD-30 code	R-CDSO-N6
Number of components	2
Number of terminals	6
Package body material	CERAMIC, METAL-SEALED COFIRED
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Polarity/channel type	PNP
Certification status	Not Qualified
surface mount	YES
Terminal form	NO LEAD
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Transistor component materials	SILICON
Nominal transition frequency (fT)	150 MHz
Base Number Matches	1

Preview

Download Datasheet

View All

BC477XDCSM

Dimensions in mm (inches).

2.29 ± 0.20

(0.09 ± 0.008)

1.65 ± 0.13

(0.065 ± 0.005)

1.40 ± 0.15

(0.055 ± 0.006)

0.64 ± 0.06

(0.025 ± 0.003)

Dual Bipolar PNP Devices in a

hermetically sealed

LCC2 Ceramic Surface Mount

Package for High Reliability

Applications

4.32 ± 0.13

(0.170 ± 0.005)

2.54 ± 0.13

(0.10 ± 0.005)

Dual Bipolar PNP Devices.

CEO

= 80V

= 0.1A

All Semelab hermetically sealed products can

be processed in accordance with the

requirements of BS, CECC and JAN, JANTX,

JANTXV and JANS specifications.

0.23 rad.

(0.009)

A = 1.27 ± 0.13

(0.05 ± 0.005)

6.22 ± 0.13

(0.245 ± 0.005)

LCC2 (MO-041BB)

Pinouts

Pin 1 – Collector 1

Pin 2 – Base 1

Pin 3 – Base 2

Pin 4 – Collector 2

Pin 5 – Emitter 2

Pin 6 – Emitter 1

Parameter

CEO

C(CONT)

Test Conditions

Min.

Typ.

Max.

0.1

Units

@ 5/2m (V

/ I

)

150M

220

0.36

* Maximum Working Voltage

This is a shortform datasheet. For a full datasheet please contact

sales@semelab.co.uk.

Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed

to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use.

Semelab plc.

Telephone +44(0)1455 556565. Fax +44(0)1455 552612.

E-mail:

sales@semelab.co.uk

Website:

http://www.semelab.co.uk

Generated

2-Aug-02

Recommended Resources

Large range 7~40V to 5VDC-DC step-down circuit diagram

Single potentiometer gain-adjustable op amp

Low noise high precision current sink circuit diagram

Metal probe water level controller

TDA1489 power amplifier circuit

15V VMOS tube regulated power supply circuit

What is the solution to the conflict between the tablet driver and the driver-free camera?: I helped my cousin upgrade his computer today, and when I got home I found that the USB driver-free camera didn't work, and the screen was black. I searched online and downloaded a black screen patch,...; daigang057 Embedded System

Why is my DS12C887 date only 30 days old?: Please advise me, hero.I use DS12C887 to make a perpetual calendar, and the time display is accurate. The date display is only 30 days, which is incorrect. Is it a problem with my program, or is it ju...; zzf405788549 51mcu

Bonding wire (essential for semiconductor packaging): The integrated circuit is connected to the leads of its package by bonding wires, which are very fine wires composed of high-purity gold, aluminum, or copper. Wirebond reliability depends greatly on t...; 安_然 Analog electronics

[Transfer] Learn WIFICC3200 audio intercom step by step: Although the board used in the article is not available, the CC3200 Launchpad can also be used....; dontium RF/Wirelessly

Using "TI" technology to break through the barriers of sign language communication: Imagine having a device that could wirelessly translate sign language into something that computers can understand. That’s what Sun Lu, a computer engineering student at the University of Texas at Dal...; maylove Analogue and Mixed Signal

My C Exercises (2): This is the first question in Chapter 7, Pointers. Write a program that calculates any floating-point numbers entered from the keyboard, stores all of them in dynamically allocated memory, and then ca...; 辛昕 Programming Basics

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components