SERIES KAC
Surface Mount Terminations (SMT)
GENERAL INFORMATION
Aeroflex / Inmet’s series of High Power Surface Mount
Terminations are ideal for high frequency applications where
small size and low costs are an important design criteria. The
ability of these chips to be directly mounted to the PC Board
eliminates the need for expensive mounting flanges and input
tabs. Large solderable surface areas on the bottom of the chips
allows for higher power dissipation in smaller sizes. All KAC
series chips are manufactured using environmentally friendly
Aluminum Nitride ceramic and are classified as RoHS compliant.
ORDERING INFORMATION
EXAMPLE: Typical Model No.
KAC
NPC
Prefix
Tinning (Optional)
H = Sn96
T = Sn63
Size
Terminal type
Ohmic Value
Tolerance, G = 2% (Standard)
NOTE
Tinning with Sn96 “Lead Free” high temperature solder will maintain RoHS
compliance.
High Power, Aluminum Nitride (AlN), 10 - 150 Watts
T 100-200A
X
50R0
Z
G
PHYSICAL DIMENSIONS
GENERAL SPECIFICATIONS
Substrate
Solderable Terminals
Resistive Element
Operating Temperature
Impedance (Nominal)
Aluminum Nitride
Electroplated Silver over Nickel
Proprietary Thick Film
-55 to +150ºC
50 Ohms
PERFORMANCE SPECIFICATIONS
W
Model Prefix
KAC 60 – 120A
in
(mm)
(2,5)
(6,4)
(6,4)
(9,5)
in
L
(mm)
in
T
(mm)
in
A
(mm)
in
B
(mm)
in
C
(mm)
VSWR
1.25
1.25
1.25
1.25
1.20
Power
CW
10
20
75
100
150
Frequency
GHz
DC – 4.0
DC – 2.0
DC – 5.0
DC – 3.5
DC – 3.0
0.060 (1,52) 0.120 (3,05) 0.025 (0,64) 0.054 (1,37) 0.026 (0,66) 0.013 (0,33)
0.200 (5,1) 0.040 (1,02) 0.050 (1.27) 0.025 (0,64) 0.035 (0,89)
0.250 (6,4) 0.040 (1,02) 0.040 (1,02) 0.043 (1,09) 0.020 (0,51)
0.375 (9,5) 0.040 (1,02) 0.135 (3,43) 0.058 (1,47) 0.060 (1,52)
0.375 (9,5) 0.040 (1,02) 0.125 (3,18) 0.057 (1,48) 0.030 (0,76)
KAC 100 – 200A 0.100
KAC 250 – 250A 0.250
KAC 250 – 375A 0.250
KAC 375 – 375A 0.375
KEY:
Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]
REV 7/14
Embedded System
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