Standard SRAM, 256X1, 50ns, TTL, CDIP16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| Maximum access time | 50 ns |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| Memory IC Type | STANDARD SRAM |
| memory width | 1 |
| Number of terminals | 16 |
| word count | 256 words |
| character code | 256 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 256X1 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class C |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| S54S200F/883C | N74S201F | S54S201F/883C | |
|---|---|---|---|
| Description | Standard SRAM, 256X1, 50ns, TTL, CDIP16 | Standard SRAM, 256X1, 50ns, TTL, CDIP16 | Standard SRAM, 256X1, 50ns, TTL, CDIP16 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown |
| Maximum access time | 50 ns | 50 ns | 50 ns |
| JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 | e0 |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 16 |
| word count | 256 words | 256 words | 256 words |
| character code | 256 | 256 | 256 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 70 °C | 125 °C |
| Minimum operating temperature | -55 °C | - | -55 °C |
| organize | 256X1 | 256X1 | 256X1 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO |
| technology | TTL | TTL | TTL |
| Temperature level | MILITARY | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) |
| Filter level | MIL-STD-883 Class C | - | MIL-STD-883 Class C |
| Base Number Matches | 1 | 1 | - |
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