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S54H10F

Description
NAND Gate, TTL, CDIP14
Categorylogic    logic   
File Size67KB,1 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

S54H10F Overview

NAND Gate, TTL, CDIP14

S54H10F Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionDIP, DIP14,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T14
JESD-609 codee0
Logic integrated circuit typeNAND GATE
MaximumI(ol)0.02 A
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
Maximum supply current (ICC)30 mA
Prop。Delay @ Nom-Sup10 ns
Certification statusNot Qualified
Schmitt triggerNO
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

S54H10F Related Products

S54H10F N74H10FB N74H10A S54H10W S54H10F/883C
Description NAND Gate, TTL, CDIP14 NAND Gate, TTL, CDIP14 NAND Gate, TTL, PDIP14 NAND Gate, TTL, CDFP14 NAND Gate, TTL, CDIP14
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DFP, FL14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown unknown unknown unknown
JESD-30 code R-XDIP-T14 R-XDIP-T14 R-PDIP-T14 R-XDFP-F14 R-XDIP-T14
JESD-609 code e0 e0 e0 e0 e0
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
MaximumI(ol) 0.02 A 0.02 A 0.02 A 0.02 A 0.02 A
Number of terminals 14 14 14 14 14
Maximum operating temperature 125 °C 70 °C 70 °C 125 °C 125 °C
Minimum operating temperature -55 °C - - -55 °C -55 °C
Package body material CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC
encapsulated code DIP DIP DIP DFP DIP
Encapsulate equivalent code DIP14,.3 DIP14,.3 DIP14,.3 FL14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE FLATPACK IN-LINE
Maximum supply current (ICC) 30 mA 30 mA 30 mA 30 mA 30 mA
Prop。Delay @ Nom-Sup 10 ns 10 ns 10 ns 10 ns 10 ns
Schmitt trigger NO NO NO NO NO
surface mount NO NO NO YES NO
technology TTL TTL TTL TTL TTL
Temperature level MILITARY COMMERCIAL COMMERCIAL MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE FLAT THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified
Base Number Matches 1 1 1 1 -
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